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 Features
* High Performance, Low Power AVR(R)32 UC 32-bit Microcontroller
- Compact Single-Cycle RISC Instruction Set Including DSP Instructions - Read-Modify-Write Instructions and Atomic Bit Manipulation - Performance * Up to 64 DMIPS Running at 50MHz from Flash (1 Flash Wait State) * Up to 36 DMIPS Running at 25MHz from Flash (0 Flash Wait State) - Memory Protection Unit picoPowerTM Technology for Ultra-Low Power Consumption Multi-Hierarchy Bus System - High-Performance Data Transfers on Separate Buses for Increased Performance - 12 Peripheral DMA Channels Improve Speed for Peripheral Communication Internal High-Speed Flash - 64Kbytes, 32Kbytes, and 16Kbytes Versions - Single-Cycle Access up to 25MHz - FlashVaultTM Technology Allows Pre-programmed Secure Library Support for End User Applications - Prefetch Buffer Optimizing Instruction Execution at Maximum Speed - 4ms Page Programming Time and 8ms Full-Chip Erase Time - 100,000 Write Cycles, 15-year Data Retention Capability - Flash Security Locks and User Defined Configuration Area Internal High-Speed SRAM, Single-Cycle Access at Full Speed - 16Kbytes (64Kbytes and 32Kbytes Flash), or 8Kbytes (16Kbytes Flash) Interrupt Controller (INTC) - Autovectored Low Latency Interrupt Service with Programmable Priority External Interrupt Controller (EIC) Peripheral Event System for Direct Peripheral to Peripheral Communication System Functions - Power and Clock Manager - SleepWalkingTM Power Saving Control - Internal System RC Oscillator (RCSYS) - 32 KHz Oscillator - Multipurpose Oscillator and Digital Frequency Locked Loop (DFLL) Windowed Watchdog Timer (WDT) Asynchronous Timer (AST) with Real-Time Clock Capability - Counter or Calendar Mode Supported Frequency Meter (FREQM) for Accurate Measuring of Clock Frequency Six 16-bit Timer/Counter (TC) Channels - External Clock Inputs, PWM, Capture and Various Counting Capabilities PWM Channels on All I/O Pins (PWMA) - 8-bit PWM up to 150MHz Source Clock Four Universal Synchronous/Asynchronous Receiver/Transmitters (USART) - Independent Baudrate Generator, Support for SPI - Support for Hardware Handshaking One Master/Slave Serial Peripheral Interfaces (SPI) with Chip Select Signals - Up to 15 SPI Slaves can be Addressed Two Master and Two Slave Two-Wire Interfaces (TWI), 400kbit/s I2C-compatible One 9-channel Analog-To-Digital Converter (ADC) with up to 12 Bits Resolution - Internal Temperature Sensor
* *
*
AVR(R)32 32-bit Microcontroller AT32UC3L064 AT32UC3L032 AT32UC3L016 Preliminary Summary
* * * * *
* * * * * *
* * *
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* Eight Analog Comparators (AC) with Optional Window Detection * Capacitive Touch (CAT) Module *
- Support QTouchTM and QMatrixTM Capture from Capacitive Touch Sensors On-Chip Non-Intrusive Debug System - Nexus Class 2+, Runtime Control, Non-Intrusive Data and Program Trace - aWireTM Single-Pin Programming Trace and Debug Interface Muxed with Reset Pin - NanoTraceTM Provides Trace Capabilities through JTAG or aWire Interface 48-pin TQFP/QFN/TLLGA (36 GPIO Pins) Five High-Drive I/O Pins Single 1.62-3.6V Power Supply
* * *
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1. Description
The AT32UC3L is a complete System-On-Chip microcontroller based on the AVR32 UC RISC processor running at frequencies up to 50MHz. AVR32 UC is a high-performance 32-bit RISC microprocessor core, designed for cost-sensitive embedded applications, with particular emphasis on low power consumption, high code density, and high performance. The processor implements a Memory Protection Unit (MPU) and a fast and flexible interrupt controller for supporting modern operating systems and real-time operating systems. Higher computation capability is achieved using a rich set of DSP instructions. The AT32UC3L embeds state-of-the-art picoPower technology for ultra-low power consumption. Combined power control techniques are used to bring active power as low as 0.5mW/MHz, and leakage down to 100nA while still retaining a bank of backup registers. The device allows a wide range of trade-offs between functionality and power consumption, giving the user the ability to reach the lowest possible power consumption with the feature set required for the application. The Peripheral Direct Memory Access (DMA) controller enables data transfers between peripherals and memories without processor involvement. The Peripheral DMA controller drastically reduces processing overhead when transferring continuous and large data streams. The AT32UC3L incorporates on-chip Flash and SRAM memories for secure and fast access. The FlashVault technology allows secure libraries to be programmed into the device. The secure libraries can be executed while the CPU is in Secure State, but not read by non-secure software in the device. The device can thus be shipped to end costumers, who will be able to program their own code into the device, accessing the secure libraries, but without risk of compromising the proprietary secure code. The Peripheral Event System allows peripherals to receive, react to, and send peripheral events without CPU intervention. Asynchronous interrupts allow advanced peripheral operation in low power sleep modes. The Power Manager improves design flexibility and security. The Power Manager supports SleepWalking functionality, by which a module can be selectively activated based on peripheral events, even in sleep modes where the module clock is stopped. Power monitoring is supported by on-chip Power-On Reset (POR), Brown-Out Detector (BOD), and Supply Monitor (SM). The device features several oscillators, such as Digital Frequency Locked Loop (DFLL), Oscillator 0 (OSC0), and system RC oscillator (RCSYS). Either of these oscillators can be used as source for the system clock. The DFLL is a programmable internal oscillator from 20 to 150MHz. It can be tuned to a high accuracy if an accurate oscillator is running, e.g. the 32KHz crystal oscillator. The Watchdog Timer (WDT) will reset the device unless it is periodically serviced by the software. This allows the device to recover from a condition that has caused the system to be unstable. The Asynchronous Timer (AST) combined with the 32KHz crystal oscillator supports powerful real-time clock capabilities, with a maximum timeout of up to 136 years. The AST can operate in counter mode or calendar mode. The Frequency Meter (FREQM) allows accurate measuring of a clock frequency by comparing it to a known reference clock. The device includes six identical 16-bit Timer/Counter (TC) channels. Each channel can be independently programmed to perform frequency measurement, event counting, interval measurement, pulse generation, delay timing, and pulse width modulation.
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The Pulse Width Modulation controller (PWMA) provides 8-bit PWM channels which can be synchronized and controlled from a common timer. One PWM channel is available for each I/O pin on the device, enabling applications that require multiple PWM outputs, such as LCD backlight control. The PWM channels can operate independently, with duty cycles set independently from each other, or in interlinked mode, with multiple channels changed at the same time. The AT32UC3L also features many communication interfaces for communication intensive applications like USART, SPI, or TWI. A general purpose 9-channel ADC is provided, as well as eight analog comparators (AC). The ADC can operate in 10-bit mode at full speed or in enhanced mode at reduced speed, offering up to 12-bit resolution. The ADC also provides an internal temperature sensor input channel. The analog comparators can be paired to detect when the sensing voltage is within or outside the defined reference window. The Capacitive Touch (CAT) module senses touch on external capacitive touch sensors, using the QTouch technology. Capacitive touch sensors use no external mechanical components, unlike normal push buttons, and therefore demand less maintenance in the user application. The CAT module allows up to 17 touch sensors, or up to 18 by 8 matrix sensors to be interfaced. One touch sensor can be configured to operate autonomously without software interaction, allowing wakeup from sleep modes when activated. The AT32UC3L integrates a class 2+ Nexus 2.0 On-Chip Debug (OCD) System, with non-intrusive real-time trace, full-speed read/write memory access, in addition to basic runtime control. The NanoTrace interface enables trace feature for aWire- or JTAG-based debuggers. The single-pin aWire interface allows all features available through the JTAG interface to be accessed through the RESET pin, allowing the JTAG pins to be used for GPIO or peripherals.
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2. Overview
2.1 Block Diagram
Figure 2-1. Block Diagram
MEMORY INTERFACE MCKO MDO[5..0] MSEO[1..0] EVTI_N EVTO_N TCK TDO TDI TMS RESET_N LOCAL BUS INTERFACE
LOCAL BUS
JTAG INTERFACE aWire
NEXUS CLASS 2+ OCD
UC CPU
MEMORY PROTECTION UNIT
INSTR INTERFACE
DATA INTERFACE
16 KB SRAM
M
M
M
S FLASH CONTROLLER
HIGH SPEED BUS MATRIX
S
64 KB FLASH
S
CONFIGURATION
S
REGISTERS BUS
M
HSB-PB BRIDGE B
HSB-PB BRIDGE A
PERIPHERAL DMA CONTROLLER
GENERALPURPOSE I/Os
POWER MANAGER
DMA
CSA[16:0]
PA PB
CLOCK CONTROLLER SLEEP CONTROLLER RESET CONTROLLER
CAPACITIVE TOUCH MODULE
CSB[16:0] SMP SYNC
USART0 USART1 USART2 USART3
RXD TXD CLK RTS, CTS
DMA
SCK DMA NPCS[3..0]
RCSYS RC32K
TWCK DMA
GENERAL PURPOSE I/Os
GCLK[4..0]
SPI
MISO, MOSI
RC120M
XIN32 XOUT32 XIN0 XOUT0
OSC32K OSC0 DFLL BOD
SYSTEM CONTROL INTERFACE
TWI MASTER 0 TWI MASTER 1
TWD TWALM TWCK
PA PB
TWI SLAVE 0 TWI SLAVE 1
DMA
TWD TWALM
DMA
INTERRUPT CONTROLLER
EXTINT[5..1] NMI
9-CHANNEL ADC INTERFACE
AD[8..0] ADVREF
EXTERNAL INTERRUPT CONTROLLER TIMER/COUNTER 0 TIMER/COUNTER 1
A[2..0]
B[2..0]
PWM[35..0]
PWM CONTROLLER ASYNCHRONOUS TIMER WATCHDOG TIMER FREQUENCY METER
CLK[2..0]
AC INTERFACE
ACBP[3..0] ACBN[3..0] ACAP[3..0] ACAN[3..0] ACREFN
GLUE LOGIC CONTROLLER
OUT[1:0] IN[7..0]
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2.2 Configuration Summary
Table 2-1.
Feature Flash SRAM GPIO Hi-drive pins
Configuration Summary
AT32UC3L0 64KB 16KB AT32UC3L1 32KB 16KB 36 5 8 2 4 12 1 1 1 6 36 1 1 1 Digital Frequency Locked Loop 20-150 MHz (DFLL) Crystal Oscillator 3-16 MHz (OSC0) Crystal Oscillator 32 KHz (OSC32K) RC Oscillator 120MHz (RC120M) RC Oscillator 115 kHz (RCSYS) RC Oscillator 32 kHz (RC32K) 9 channel 10-bit 1 8 1 1 1 50 MHz TQFP48/QFN48/TLLGA48 AT32UC3L2 16KB 8KB
External Interrupts TWI USART Peripheral DMA Channels Peripheral Event System SPI Asynchronous Timers Timer/Counter Channels PWM channels Frequency Meter Watchdog Timer Power Manager
Oscillators
ADC Temperature Sensor Analog Comparators Capacitive Touch Module JTAG aWire Max Frequency Package
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3. Package and Pinout
3.1 Package
The device pins are multiplexed with peripheral functions as described in Section 3.2. Figure 3-1. TQFP48/QFN48/TLLGA48 Pinout
PA15 PA16 PA17 PA19 PA18 VDDIO GND PB11 GND PA10 PA12 VDDIO
37 38 39 40 41 42 43 44 45 46 47 48 12 11 10 9 8 7 6 5 4 3 2 1 PA05 PA00 PA06 PA22 PB03 PB02 PB00 PB12 PA03 PA08 PA09 GND
36 35 34 33 32 31 30 29 28 27 26 25 24 23 22 21 20 19 18 17 16 15 14 13
PA14 VDDANA ADVREFP GNDANA PB08 PB07 PB06 PB09 PA04 PA11 PA13 PA20
PA21 PB10 RESET_N PB04 PB05 GND VDDCORE VDDIN PB01 PA07 PA01 PA02
3.2
3.2.1
Peripheral Multiplexing on I/O lines
Multiplexed signals Each GPIO line can be assigned to one of the peripheral functions.The following table describes the peripheral signals multiplexed to the GPIO lines.
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Table 3-1.
Q F P 48
11 14 13 4 28
GPIO Controller Function Multiplexing
GPIO Function G PI O
0 1 2 3 4
PIN
PA00 PA01 PA02 PA03 PA04
Supply
VDDIO VDDIO VDDIO VDDIO VDDIO
Pad Type
Normal I/O Normal I/O Highdrive I/O Normal I/O Normal I/O TWI, Normal I/O Highdrive I/O, 5V tolerant TWI, Normal I/O Highdrive I/O Highdrive I/O Normal I/O Normal I/O Normal I/O Normal I/O Normal I/O Normal I/O Normal I/O TWI, Normal I/O Normal I/O Normal I/O Normal I/O
A
USART0TXD USART0RXD USART0RTS USART0CTS SPI-MISO
B
USART1RTS USART1CTS ADCIFBTRIGGER SPINPCS[1] TWIMS0TWCK TWIMS1TWCK
C
SPINPCS[2] SPINPCS[3] USART2TXD USART2TXD USART1RXD USART1TXD
D
E
PWMAPWMA[0]
F
G
SCIFGCLK[0]
H
CAT-CSA[2] CAT-CSA[1] CAT-CSA[3] CAT-CSB[3] CAT-CSA[7]
USART1CLK TC0-A0 TC0-B0 TC0-B1
PWMAPWMA[1] PWMAPWMA[2] PWMAPWMA[3] PWMAPWMA[4] PWMAPWMA[5]
ACIFBACAP[0] ACIFBACBP[0] ACIFBACBN[3] ACIFBACBP[1] ACIFBACBN[0]
TWIMS0TWALM USART0CLK USART0CLK
12
PA05
5
VDDIO
SPI-MOSI
TC0-A1
TWIMS0TWD
CAT-CSB[7]
10
PA06
6
VDDIO
SPI-SCK
USART2TXD
USART1CLK
TC0-B0
PWMAPWMA[6]
SCIFGCLK[1]
CAT-CSB[1]
15
PA07
7
VDDIO
SPINPCS[0] USART1TXD USART1RXD TWIMS0TWD
USART2RXD SPINPCS[2] SPINPCS[3]
TWIMS1TWALM TC0-A2 TC0-B2 TC0-A0
TWIMS0TWCK ADCIFBADP[0] ADCIFBADP[1]
PWMAPWMA[7] PWMAPWMA[8] PWMAPWMA[9] PWMAPWMA[10] PWMAPWMA[11]
ACIFBACAN[0]
EICEXTINT[0]
CAT-CSB[2]
3 2 46 27 47 26 36 37 38
PA08 PA09 PA10 PA11 PA12 PA13 PA14 PA15 PA16
8 9 10 11 12 13 14 15 16
VDDIO VDDIO VDDIO VDDIN VDDIO VDDIN VDDIO VDDIO VDDIO
CAT-CSA[4] SCIF-GCLK[2] ACIFBACAP[1] EICEXTINT[1] SCIFGCLK[2] CAT-CSB[4] CAT-CSA[5]
ADCIFBPRND GLOCOUT[0] ADCIFBAD[0] ADCIFBAD[1] ADCIFBAD[2] ADCIFBAD[3] ADCIFBAD[4] ADCIFBAD[5] USART2TXD
USART2CLK GLOC-IN[7] TC0-CLK2 TC0-CLK1 TC0-CLK0
TC0-CLK1 TC0-A0 USART2RTS
CAT-SMP SCIFGCLK[2] CAT-SMP GLOC-IN[6] GLOC-IN[5]
PWMAPWMA[12] PWMAPWMA[13] PWMAPWMA[14] PWMAPWMA[15] PWMAPWMA[16] PWMAPWMA[17] PWMAPWMA[18] PWMAPWMA[19] PWMAPWMA[20]
ACIFBACAN[1] CAT-SMP
SCIFGCLK[3] EICEXTINT[2] SCIFGCLK[4]
CAT-CSB[5] CAT-CSA[0] CAT-CSA[6] CAT-CSB[6] CAT-CSA[8]
CAT-SYNC ACIFBACREFN CAT-SMP
EICEXTINT[3] EICEXTINT[4] CAT-DIS EICEXTINT[5] CAT-SYNC
39
PA17
17
VDDIO
TC0-A1
USART2CTS
TWIMS1TWD GLOC-IN[4]
CAT-CSB[8]
41 40 25
PA18 PA19 PA20
18 19 20
VDDIO VDDIO VDDIN
TC0-B1 TC0-A2 TWIMS0TWCK TC0-A1
CAT-SYNC
CAT-CSB[0] CATCSA[10] CATCSA[12]
TWIMS1TWALM GLOC-IN[3]
SCIFRC32OUT
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Table 3-1. GPIO Controller Function Multiplexing
TWI, 5V tolerant, SMBus, Normal I/O Normal I/O Normal I/O Highdrive I/O Normal I/O Normal I/O TWI, 5V tolerant, SMBus, Normal I/O TWI, 5V tolerant, SMBus, Normal I/O Normal I/O Normal I/O Normal I/O Normal I/O Normal I/O Normal I/O Normal I/O USART2RXD TWIMS0TWD ADCIFBTRIGGER PWMAPWMA[21] PWMAPWMAOD[21] SCIFGCLK[0]
24
PA21
21
VDDIN
TC0-B1
CAT-SMP
9 6 16 7 8
PA22 PB00 PB01 PB02 PB03
22 32 33 34 35
VDDIO VDDIO VDDIO VDDIO VDDIO
USART0CTS USART3TXD USART3RXD USART3RTS USART3CTS
USART2CLK ADCIFBADP[0] ADCIFBADP[1] USART3CLK USART3CLK
TC0-B2 SPINPCS[0] SPI-SCK SPI-MISO SPI-MOSI
CAT-SMP TC0-A1 TC0-B1 TC0-A2 TC0-B2
PWMAPWMA[22] PWMAPWMA[23] PWMAPWMA[24] PWMAPWMA[25] PWMAPWMA[26]
ACIFBACBN[2] ACIFBACAP[2] TC1-A0 TC1-A1 ACIFBACAN[2] ACIFBACBP[2] SCIFGCLK[1] TC1-A2
CATCSB[10] CAT-CSA[9] CAT-CSB[9] CATCSB[11] CATCSA[11]
21
PB04
36
VDDIN
TC1-A0
USART1RTS
USART1CLK
TWIMS0TWALM
PWMAPWMA[27]
PWMAPWMAOD[27]
TWIMS1TWCK
CATCSA[14]
20
PB05
37
VDDIN
TC1-B0
USART1CTS
USART1CLK
TWIMS0TWCK
PWMAPWMA[28]
PWMAPWMAOD[28]
SCIFGCLK[3]
CATCSB[14]
30 31 32 29 23 44 5
PB06 PB07 PB08 PB09 PB10 PB11 PB12
38 39 40 41 42 43 44
VDDIO VDDIO VDDIO VDDIO VDDIN VDDIO VDDIO
TC1-A1 TC1-B1 TC1-A2 TC1-B2 TC1-CLK0 TC1-CLK1 TC1-CLK2
USART3TXD USART3RXD USART3RTS USART3CTS USART1TXD USART1RXD
ADCIFBAD[6] ADCIFBAD[7] ADCIFBAD[8] USART3CLK USART3CLK
GLOC-IN[2] GLOC-IN[1] GLOC-IN[0]
PWMAPWMA[29] PWMAPWMA[30] PWMAPWMA[31] PWMAPWMA[32]
ACIFBACAN[3] ACIFBACAP[3] CAT-SYNC ACIFBACBN[1]
EICEXTINT[0] EICEXTINT[1] EICEXTINT[2] EICEXTINT[3] EICEXTINT[4]
CATCSB[13] CATCSA[13] CATCSB[12] CATCSB[15] CATCSB[16] CATCSA[16] CATCSA[15]
GLOCOUT[1] ADCIFBTRIGGER
PWMAPWMA[33] PWMAPWMA[34] PWMAPWMA[35] CAT-VDIVEN ACIFBACBP[3]
EICEXTINT[5] SCIFGCLK[4]
TWIMS1TWALM
CAT-SYNC
See Section 3.3 for a description of the various peripheral signals. Signals are prioritized according to the function priority listed in Table 3-2 on page 10 if multiple functions are enabled simultaneously. Refer to "Electrical Characteristics" on page 40 for a description of the electrical properties of the pad types used.
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3.2.2 Peripheral Functions Each GPIO line can be assigned to one of several peripheral functions. The following table describes how the various peripheral functions are selected. The last listed function has priority in case multiple functions are enabled. Table 3-2.
Function A B C D E F G H
Peripheral Functions
Description GPIO peripheral selection A GPIO peripheral selection B GPIO peripheral selection C GPIO peripheral selection D GPIO peripheral selection E GPIO peripheral selection F GPIO peripheral selection G GPIO peripheral selection H
3.2.3
JTAG Port Connections If the JTAG is enabled, the JTAG will take control over a number of pins, irrespective of the I/O Controller configuration. Table 3-3. JTAG Pinout
Pin name PA00 PA01 PA02 PA03 JTAG pin TCK TMS TDO TDI
48TQFP/QFN pin 11 14 13 4
3.2.4
Nexus OCD AUX Port Connections If the OCD trace system is enabled, the trace system will take control over a number of pins, respectively of the I/O Controller configuration. Two different OCD trace pin mappings are possible, depending on the configuration of the OCD AXS register. For details, see the AVR32 UC Technical Reference Manual. Table 3-4.
Pin EVTI_N MDO[5] MDO[4] MDO[3] MDO[2] MDO[1] MDO[0]
Nexus OCD AUX Port Connections
AXS=1 PA05 PA10 PA18 PA17 PA16 PA15 PA14 AXS=0 PB08 PB00 PB04 PB05 PB03 PB02 PB09
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Table 3-4.
Pin EVTO_N MCKO MSEO[1] MSEO[0]
Nexus OCD AUX Port Connections
AXS=1 PA04 PA06 PA07 PA11 AXS=0 PA04 PB01 PB11 PB12
3.2.5
Oscillator Pinout The oscillators are not mapped to the normal GPIO functions and their muxings are controlled by registers in the System Control Interface (SCIF). Please refer to the SCIF chapter for more information about this. Table 3-5. Oscillator Pinout
Pin PA08 PA10 PA13 PA09 PA12 PA20 Oscillator Function XIN0 XIN32 XIN32_2 XOUT0 XOUT32 XOUT32_2
48TQFP/QFN/TLLGA 3 46 26 2 47 25
3.2.6
Other Functions The functions listed in Table 3-6 are not mapped to the normal GPIO functions.The aWire DATA pin will only be active after the aWire is enabled. The aWire DATAOUT pin will only be actice after the aWire is enabled and the full duplex command has been sent. The WAKE_N pin is always enabled. Please refer to Section 3.5.4 on page 20 for constraints on the WAKE_N pin. Table 3-6. Other Functions
Pin PA11 RESET_N PA00 Function WAKE_N aWire DATA aWire DATAOUT
48TQFP/TQFN/TLLGA 27 22 11
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3.3 Signal Descriptions
The following table gives details on signal name classified by peripheral. Table 3-7.
Signal Name
Signal Descriptions List
Function Type Analog Comparator Interface - ACIFB Active Level Comments
ACAN3 - ACAN0 ACAP3 - ACAP0 ACBN3 - ACBN0 ACBP3 - ACBP0 ACREFN
Negative inputs for comparators "A" Positive inputs for comparators "A" Negative inputs for comparators "B" Positive inputs for comparators "B" Common negative reference
Analog Analog Analog Analog Analog
ADC Interface - ADCIFB AD8 - AD0 ADP1 - ADP0 PRND TRIGGER Analog Signal Drive Pin for touch screen Pseudorandom output signal External trigger aWire - AW DATA DATAOUT aWire data aWire data output for full duplex mode I/O I/O Analog Output Output Input
Capacitive Touch Module - CAT CSA16 - CSA0 CSB16 - CSB0 SMP SYNC VDIVEN Capacitive Sense A Capacitive Sense B SMP signal Synchronize signal Voltage divider enable I/O I/O Output Input Output
External Interrupt Controller - EIC NMI EXTINT5 - EXTINT1 Non-Maskable Interrupt External interrupt Input Input Glue Logic Controller - GLOC IN7 - IN0 OUT1 - OUT0 Inputs to lookup tables Outputs from lookup tables Input Output JTAG module - JTAG TCK TDI TDO TMS Test Clock Test Data In Test Data Out Test Mode Select Input Input Output Input Power Manager - PM
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Table 3-7.
RESET_N
Signal Descriptions List
Reset Input Low
Basic Pulse Width Modulation Controller - PWMA PWMA35 - PWMA0 PWMAOD35 PWMAOD0 PWMA channel waveforms PWMA channel waveforms, open drain mode Output Output Not all channels support open drain mode
System Control Interface - SCIF GCLK4 - GCLK0 RC32OUT XIN0 XIN32 XIN32_2 XOUT0 XOUT32 XOUT32_2 Generic Clock Output RC32K output at startup Crystal 0 Input Crystal 32 Input (primary location) Crystal 32 Input (secondary location) Crystal 0 Output Crystal 32 Output (primary location) Crystal 32 Output (secondary location) Output Output Analog/ Digital Analog/ Digital Analog/ Digital Analog Analog Analog
Serial Peripheral Interface - SPI MISO MOSI NPCS3 - NPCS0 SCK Master In Slave Out Master Out Slave In SPI Peripheral Chip Select Clock I/O I/O I/O I/O Timer/Counter - TC0, TC1 A0 A1 A2 B0 B1 B2 CLK0 CLK1 CLK2 Channel 0 Line A Channel 1 Line A Channel 2 Line A Channel 0 Line B Channel 1 Line B Channel 2 Line B Channel 0 External Clock Input Channel 1 External Clock Input Channel 2 External Clock Input I/O I/O I/O I/O I/O I/O Input Input Input Low
Two-wire Interface - TWIMS0, TWIMS1 TWALM TWCK TWD SMBus SMBALERT Two-wire Serial Clock Two-wire Serial Data I/O I/O I/O Low
Universal Synchronous/Asynchronous Receiver/Transmitter - USART0, USART1, USART2, USART3 CLK Clock I/O
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Table 3-7.
CTS RTS RXD TXD
Signal Descriptions List
Clear To Send Request To Send Receive Data Transmit Data Input Output Input Output Low Low
Table 3-8.
Signal Name
Signal Description List, continued
Function Power Type Active Level Comments
VDDCORE
Core Power Supply / Voltage Regulator Output
Power Input/Output
1.62 V to 1.98 V 1.62 V to 3.6 V. VDDIO should always be equal to or lower than VDDIN. 1.62 V to 1.98 V TBD to 1.98 V 1.62 V to 3.6V (1)
VDDIO
I/O Power Supply
Power Input
VDDANA ADVREFP VDDIN GNDANA GND
Analog Power Supply Analog Reference Voltage Voltage Regulator Input Analog Ground Ground
Power Input Power Input Power Input Ground Ground Auxiliary Port - AUX
MCKO MDO5 - MDO0 MSEO1 - MSEO0 EVTI_N EVTO_N
Trace Data Output Clock Trace Data Output Trace Frame Control Event In Event Out
Output Output Output Input Output Low Low
General Purpose I/O pin - GPIOA, GPIOB PA22 - PA0 PB12 - PB0 1. See Section 3.5 Parallel I/O Controller GPIOA Parallel I/O Controller GPIOB I/O I/O
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3.4
3.4.1
I/O Line Considerations
JTAG Pins The JTAG is enabled if TCK is low while the RESET_N pin is released. The TCK, TMS, and TDI pins have pull-up resistors when JTAG is enabled. TDO pin is an output, driven at VDDIO, and has no pull-up resistor. These JTAG pins can be used as GPIO pins and muxed with peripherals when the JTAG is disabled.
3.4.2
RESET_N Pin The RESET_N pin is a schmitt input and integrates a permanent pull-up resistor to VDDIO. As the product integrates a power-on reset detector, the RESET_N pin can be left unconnected in case no reset from the system needs to be applied to the product. The RESET_N pin is also used for the aWire debug protocol. When the pin is used for debugging, it must not be driven by the application.
3.4.3
TWI Pins When these pins are used for TWI, the pins are open-drain outputs with slew-rate limitation and inputs with inputs with spike-filtering. When used as GPIO pins or used for other peripherals, the pins have the same characteristics as GPIO pins.
3.4.4
GPIO Pins All the I/O lines integrate a pull-up resistor. Programming of this pull-up resistor is performed independently for each I/O line through the GPIO Controllers. After reset, I/O lines default as inputs with pull-up resistors disabled, except PA00.
3.4.5
ADC Input Pins These pins are regular I/O pins powered from the VDDIO. However, when these pins are used for ADC inputs, the voltage applied to the pin must not exceed 1.98V. Internal circuitry ensures that the pin cannot be used as an analog input pin when the I/O drives to VDD. When the pins are not used for ADC inputs, the pins may be driven to the full I/O voltage range.
3.5
3.5.1
Power Considerations
Power Supplies The AT32UC3L has several types of power supply pins: * VDDIO: Powers I/O lines. Voltage is 1.8 to 3.3V nominal. * VDDIN: Powers I/O lines and the internal regulator. Voltage is 1.8 to 3.3V nominal. * VDDANA: Powers the ADC. Voltage is 1.8V nominal. * VDDCORE: Powers the core, memories, and peripherals. Voltage is 1.8V nominal. The ground pins GND are common to VDDCORE and VDDIO. The ground pin for VDDANA is GNDANA. Refer to "Electrical Characteristics" on page 40 for power consumption on the various supply pins.
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3.5.2 Voltage Regulator The AT32UC3L embeds a voltage regulator that converts from 3.3V nominal to 1.8V with a load of up to 60 mA. The regulator supplies the output voltage on VDDCORE. VDDCORE should be externally connected to the 1.8V domains. See Section 3.5.3 for regulator connection figures. Adequate output supply decoupling is mandatory for VDDCORE to reduce ripple and avoid oscillations. The best way to achieve this is to use two capacitors in parallell between VDDCORE and GND as close to the chip as possible. Please refer to Section 7.9.1 for decoupling capacitors values and regulator characteristics. Figure 3-2. Supply Decoupling
3.3V
CIN2 CIN1
VDDIN
1.8V Regulator
VDDCORE
1.8V
COUT2
3.5.3 Regulator Connection
COUT1
The AT32UC3L supports three power supply configurations: * 3.3V single supply mode * 1.8V single supply mode * 3.3V supply mode, with 1.8V regulated I/O lines 3.5.3.1 3.3V Single Supply Mode In 3.3V single supply mode the internal regulator is connected to the 3.3V source (VDDIN pin) and its output feeds VDDCORE. Figure 3-3 shows the power schematics to be used for 3.3V single supply mode. All I/O lines will be powered by the same power (VDDIN=VDDIO).
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Figure 3-3. 3.3V Single Power Supply mode
+
TBD-3.6V
-
VDDIN
VDDIO
GND
I/O Pins Linear VDDCORE
I/O Pins OSC32K RC32K AST Wake POR33 SM33 CPU, Peripherals, Memories, SCIF, BOD, RCSYS, DFLL
VDDANA
ADC
GNDANA
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3.5.3.2 1.8V Single Supply Mode In 1.8V single supply mode the internal regulator is not used, and VDDIO and VDDCORE are powered by a single 1.8V supply as shown in Figure 3-4. All I/O lines will be powered by the same power (VDDIN = VDDIO = VDDCORE). Figure 3-4. 1.8V Single Power Supply Mode.
+
1.62-1.98V
-
VDDIN
VDDIO
GND
I/O Pins Linear VDDCORE
I/O Pins OSC32K RC32K AST Wake POR33 SM33 CPU, Peripherals, Memories, SCIF, BOD, RCSYS, DFLL
VDDANA
ADC
GNDANA
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3.5.3.3 3.3V Supply Mode with 1.8V Regulated I/O Lines In this mode, the internal regulator is connected to the 3.3V source and its output is connected to both VDDCORE and VDDIO as shown in Figure 3-5. This configuration is required in order to use Shutdown mode. Figure 3-5. 3.3V Power with 1.8V Regulated I/O Lines
TBD-3.6V
+
VDDIN
-
VDDIO
GND
I/O Pins Linear VDDCORE
I/O Pins OSC32K RC32K AST Wake POR33 SM33 CPU, Peripherals, Memories, SCIF, BOD, RCSYS, DFLL
VDDANA
ADC
GNDANA
In this mode, some I/O lines are powered by VDDIN while others I/O lines are powered by VDDIO. Refer to Table 3-1 on page 8 for description of power supply for each I/O line. Important note: As the regulator has a maximum output current of 60mA, this mode can only be used in applications where the maximum I/O current is known and compatible with the core and peripheral power consumption. Typically, great care must be used to ensure that only a few I/O lines are toggling at the same time and drive very small loads.
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3.5.4 3.5.4.1 Power-up Sequence Maximum Rise Rate To avoid risk of latch-up, the rise rate of the power supplies must not exceed the values described in Table 7-3 on page 41. Recommended order for power supplies is also described in this table. 3.5.4.2 Minimum Rise Rate The integrated Power-Reset circuitry monitoring the VDDIN powering supply requires a minimum rise rate for the VDDIN power supply. See Table 7-3 on page 41 for the minimum rise rate value. If the application can not ensure that the minimum rise rate condition for the VDDIN power supply is met, one of the following configuration can be used: * A logic "0" value is applied during power-up on pin PA11 until VDDIN rises above 1.2V. * A logic "0" value is applied during power-up on pin RESET_N until VDDIN rises above 1.2V.
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4. Processor and Architecture
Rev: 2.1.0.0 This chapter gives an overview of the AVR32UC CPU. AVR32UC is an implementation of the AVR32 architecture. A summary of the programming model, instruction set, and MPU is presented. For further details, see the AVR32 Architecture Manual and the AVR32UC Technical Reference Manual.
4.1
Features
* 32-bit load/store AVR32A RISC architecture
15 general-purpose 32-bit registers 32-bit Stack Pointer, Program Counter and Link Register reside in register file Fully orthogonal instruction set Privileged and unprivileged modes enabling efficient and secure operating systems Innovative instruction set together with variable instruction length ensuring industry leading code density - DSP extention with saturating arithmetic, and a wide variety of multiply instructions * 3-stage pipeline allowing one instruction per clock cycle for most instructions - Byte, halfword, word, and double word memory access - Multiple interrupt priority levels * MPU allows for operating systems with memory protection * Secure State for supporting FlashVaultTM technology - - - - -
4.2
AVR32 Architecture
AVR32 is a new, high-performance 32-bit RISC microprocessor architecture, designed for costsensitive embedded applications, with particular emphasis on low power consumption and high code density. In addition, the instruction set architecture has been tuned to allow a variety of microarchitectures, enabling the AVR32 to be implemented as low-, mid-, or high-performance processors. AVR32 extends the AVR family into the world of 32- and 64-bit applications. Through a quantitative approach, a large set of industry recognized benchmarks has been compiled and analyzed to achieve the best code density in its class. In addition to lowering the memory requirements, a compact code size also contributes to the core's low power characteristics. The processor supports byte and halfword data types without penalty in code size and performance. Memory load and store operations are provided for byte, halfword, word, and double word data with automatic sign- or zero extension of halfword and byte data. The C-compiler is closely linked to the architecture and is able to exploit code optimization features, both for size and speed. In order to reduce code size to a minimum, some instructions have multiple addressing modes. As an example, instructions with immediates often have a compact format with a smaller immediate, and an extended format with a larger immediate. In this way, the compiler is able to use the format giving the smallest code size. Another feature of the instruction set is that frequently used instructions, like add, have a compact format with two operands as well as an extended format with three operands. The larger format increases performance, allowing an addition and a data move in the same instruction in a single cycle. Load and store instructions have several different formats in order to reduce code size and speed up execution.
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The register file is organized as sixteen 32-bit registers and includes the Program Counter, the Link Register, and the Stack Pointer. In addition, register R12 is designed to hold return values from function calls and is used implicitly by some instructions.
4.3
The AVR32UC CPU
The AVR32UC CPU targets low- and medium-performance applications, and provides an advanced On-Chip Debug (OCD) system, no caches, and a Memory Protection Unit (MPU). Java acceleration hardware is not implemented. AVR32UC provides three memory interfaces, one High Speed Bus master for instruction fetch, one High Speed Bus master for data access, and one High Speed Bus slave interface allowing other bus masters to access data RAMs internal to the CPU. Keeping data RAMs internal to the CPU allows fast access to the RAMs, reduces latency, and guarantees deterministic timing. Also, power consumption is reduced by not needing a full High Speed Bus access for memory accesses. A dedicated data RAM interface is provided for communicating with the internal data RAMs. A local bus interface is provided for connecting the CPU to device-specific high-speed systems, such as floating-point units and I/O controller ports. This local bus has to be enabled by writing a one to the LOCEN bit in the CPUCR system register. The local bus is able to transfer data between the CPU and the local bus slave in a single clock cycle. The local bus has a dedicated memory range allocated to it, and data transfers are performed using regular load and store instructions. Details on which devices that are mapped into the local bus space is given in the CPU Local Bus section in the Memories chapter. Figure 4-1 on page 23 displays the contents of AVR32UC.
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Figure 4-1. Overview of the AVR32UC CPU
Reset interface OCD interface
Interrupt controller interface
OCD system
Power/ Reset control
AVR32UC CPU pipeline
MPU
Instruction memory controller High Speed Bus master
High Speed Bus
Data memory controller High Speed Bus slave
High Speed Bus
High Speed Bus master
CPU Local Bus master
CPU Local Bus
CPU RAM
4.3.1
Pipeline Overview AVR32UC has three pipeline stages, Instruction Fetch (IF), Instruction Decode (ID), and Instruction Execute (EX). The EX stage is split into three parallel subsections, one arithmetic/logic (ALU) section, one multiply (MUL) section, and one load/store (LS) section. Instructions are issued and complete in order. Certain operations require several clock cycles to complete, and in this case, the instruction resides in the ID and EX stages for the required number of clock cycles. Since there is only three pipeline stages, no internal data forwarding is required, and no data dependencies can arise in the pipeline. Figure 4-2 on page 24 shows an overview of the AVR32UC pipeline stages.
High Speed Bus
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Figure 4-2. The AVR32UC Pipeline
MUL
Multiply unit
IF
ID
Regfile Read
ALU
Regfile write
ALU unit
Prefetch unit
Decode unit Load-store unit
LS
4.3.2
AVR32A Microarchitecture Compliance AVR32UC implements an AVR32A microarchitecture. The AVR32A microarchitecture is targeted at cost-sensitive, lower-end applications like smaller microcontrollers. This microarchitecture does not provide dedicated hardware registers for shadowing of register file registers in interrupt contexts. Additionally, it does not provide hardware registers for the return address registers and return status registers. Instead, all this information is stored on the system stack. This saves chip area at the expense of slower interrupt handling. Interrupt Handling Upon interrupt initiation, registers R8-R12 are automatically pushed to the system stack. These registers are pushed regardless of the priority level of the pending interrupt. The return address and status register are also automatically pushed to stack. The interrupt handler can therefore use R8-R12 freely. Upon interrupt completion, the old R8-R12 registers and status register are restored, and execution continues at the return address stored popped from stack. The stack is also used to store the status register and return address for exceptions and scall. Executing the rete or rets instruction at the completion of an exception or system call will pop this status register and continue execution at the popped return address.
4.3.2.1
4.3.2.2
Java Support AVR32UC does not provide Java hardware acceleration. Memory Protection The MPU allows the user to check all memory accesses for privilege violations. If an access is attempted to an illegal memory address, the access is aborted and an exception is taken. The MPU in AVR32UC is specified in the AVR32UC Technical Reference manual. Unaligned Reference Handling AVR32UC does not support unaligned accesses, except for doubleword accesses. AVR32UC is able to perform word-aligned st.d and ld.d. Any other unaligned memory access will cause an address exception. Doubleword-sized accesses with word-aligned pointers will automatically be performed as two word-sized accesses.
4.3.2.3
4.3.2.4
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The following table shows the instructions with support for unaligned addresses. All other instructions require aligned addresses. Table 4-1.
Instruction ld.d st.d
Instructions with Unaligned Reference Support
Supported Alignment Word Word
4.3.2.5
Unimplemented Instructions The following instructions are unimplemented in AVR32UC, and will cause an Unimplemented Instruction Exception if executed: * All SIMD instructions * All coprocessor instructions if no coprocessors are present * retj, incjosp, popjc, pushjc * tlbr, tlbs, tlbw * cache
4.3.2.6
CPU and Architecture Revision Three major revisions of the AVR32UC CPU currently exist. The device described in this datasheet uses CPU revision 3. The Architecture Revision field in the CONFIG0 system register identifies which architecture revision is implemented in a specific device. AVR32UC CPU revision 3 is fully backward-compatible with revisions 1 and 2, ie. code compiled for revision 1 or 2 is binary-compatible with revision 3 CPUs.
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4.4
4.4.1
Programming Model
Register File Configuration The AVR32UC register file is shown below. Figure 4-3.
Application
Bit 31 Bit 0 Bit 31
The AVR32UC Register File
INT0
Bit 31 Bit 0
Supervisor
Bit 0
INT1
Bit 31 Bit 0
INT2
Bit 31 Bit 0
INT3
Bit 31 Bit 0
Exception
Bit 31 Bit 0
NMI
Bit 31 Bit 0
Secure
Bit 31 Bit 0
PC LR SP_APP R12 R11 R10 R9 R8 INT0PC R7 INT1PC R6 FINTPC R5 SMPC R4 R3 R2 R1 R0 SR
PC LR SP_SYS R12 R11 R10 R9 R8 INT0PC R7 INT1PC R6 FINTPC R5 SMPC R4 R3 R2 R1 R0 SR
PC LR SP_SYS R12 R11 R10 R9 R8 INT0PC R7 INT1PC R6 FINTPC R5 SMPC R4 R3 R2 R1 R0 SR
PC LR SP_SYS R12 R11 R10 R9 R8 INT0PC R7 INT1PC R6 FINTPC R5 SMPC R4 R3 R2 R1 R0 SR
PC LR SP_SYS R12 R11 R10 R9 R8 INT0PC R7 INT1PC R6 FINTPC R5 SMPC R4 R3 R2 R1 R0 SR
PC LR SP_SYS R12 R11 R10 R9 R8 INT0PC R7 INT1PC R6 FINTPC R5 SMPC R4 R3 R2 R1 R0 SR
PC LR SP_SYS R12 R11 R10 R9 R8 INT0PC R7 INT1PC R6 FINTPC R5 SMPC R4 R3 R2 R1 R0 SR
PC LR SP_SYS R12 R11 R10 R9 R8 INT0PC R7 INT1PC R6 FINTPC R5 SMPC R4 R3 R2 R1 R0 SR
PC LR SP_SEC R12 R11 R10 R9 R8 INT0PC R7 INT1PC R6 FINTPC R5 SMPC R4 R3 R2 R1 R0 SR
SS_STATUS SS_ADRF SS_ADRR SS_ADR0 SS_ADR1 SS_SP_SYS SS_SP_APP SS_RAR SS_RSR
4.4.2
Status Register Configuration The Status Register (SR) is split into two halfwords, one upper and one lower, see Figure 4-4 and Figure 4-5. The lower word contains the C, Z, N, V, and Q condition code flags and the R, T, and L bits, while the upper halfword contains information about the mode and state the processor executes in. Refer to the AVR32 Architecture Manual for details. Figure 4-4.
Bit 31
The Status Register High Halfword
Bit 16
SS
LC 1 0
-
-
DM
D
-
M2
M1
M0
EM
I3M
I2M FE
I1M
I0M
GM
Bit name Initial value Global Interrupt Mask Interrupt Level 0 Mask Interrupt Level 1 Mask Interrupt Level 2 Mask Interrupt Level 3 Mask Exception Mask Mode Bit 0 Mode Bit 1 Mode Bit 2 Reserved Debug State Debug State Mask Reserved Secure State
0
0
0
0
0
0
0
0
1
1
0
0
0
0
1
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Figure 4-5.
Bit 15
The Status Register Low Halfword
Bit 0
0
T 0
0
0
0
0
0
0
0
0
L 0
Q 0
V 0
N 0
Z 0
C 0
Bit name Initial value Carry Zero Sign Overflow Saturation Lock Reserved Scratch Reserved
4.4.3 4.4.3.1
Processor States Normal RISC State The AVR32 processor supports several different execution contexts as shown in Table 4-2. Table 4-2.
Priority 1 2 3 4 5 6 N/A N/A
Overview of Execution Modes, their Priorities and Privilege Levels.
Mode Non Maskable Interrupt Exception Interrupt 3 Interrupt 2 Interrupt 1 Interrupt 0 Supervisor Application Security Privileged Privileged Privileged Privileged Privileged Privileged Privileged Unprivileged Description Non Maskable high priority interrupt mode Execute exceptions General purpose interrupt mode General purpose interrupt mode General purpose interrupt mode General purpose interrupt mode Runs supervisor calls Normal program execution mode
Mode changes can be made under software control, or can be caused by external interrupts or exception processing. A mode can be interrupted by a higher priority mode, but never by one with lower priority. Nested exceptions can be supported with a minimal software overhead. When running an operating system on the AVR32, user processes will typically execute in the application mode. The programs executed in this mode are restricted from executing certain instructions. Furthermore, most system registers together with the upper halfword of the status register cannot be accessed. Protected memory areas are also not available. All other operating modes are privileged and are collectively called System Modes. They have full access to all privileged and unprivileged resources. After a reset, the processor will be in supervisor mode. 4.4.3.2 Debug State The AVR32 can be set in a debug state, which allows implementation of software monitor routines that can read out and alter system information for use during application development. This implies that all system and application registers, including the status registers and program counters, are accessible in debug state. The privileged instructions are also available. All interrupt levels are by default disabled when debug state is entered, but they can individually be switched on by the monitor routine by clearing the respective mask bit in the status register.
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Debug state can be entered as described in the AVR32UC Technical Reference Manual. Debug state is exited by the retd instruction. 4.4.3.3 Secure State The AVR32 can be set in a secure state, that allows a part of the code to execute in a state with higher security levels. The rest of the code can not access resources reserved for this secure code. Secure State is used to implement FlashVault technology. Refer to the AVR32UC Technical Reference Manual for details. System Registers The system registers are placed outside of the virtual memory space, and are only accessible using the privileged mfsr and mtsr instructions. The table below lists the system registers specified in the AVR32 architecture, some of which are unused in AVR32UC. The programmer is responsible for maintaining correct sequencing of any instructions following a mtsr instruction. For detail on the system registers, refer to the AVR32UC Technical Reference Manual. Table 4-3.
Reg # 0 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23
4.4.4
System Registers
Address 0 4 8 12 16 20 24 28 32 36 40 44 48 52 56 60 64 68 72 76 80 84 88 92 Name SR EVBA ACBA CPUCR ECR RSR_SUP RSR_INT0 RSR_INT1 RSR_INT2 RSR_INT3 RSR_EX RSR_NMI RSR_DBG RAR_SUP RAR_INT0 RAR_INT1 RAR_INT2 RAR_INT3 RAR_EX RAR_NMI RAR_DBG JECR JOSP JAVA_LV0 Function Status Register Exception Vector Base Address Application Call Base Address CPU Control Register Exception Cause Register Unused in AVR32UC Unused in AVR32UC Unused in AVR32UC Unused in AVR32UC Unused in AVR32UC Unused in AVR32UC Unused in AVR32UC Return Status Register for Debug mode Unused in AVR32UC Unused in AVR32UC Unused in AVR32UC Unused in AVR32UC Unused in AVR32UC Unused in AVR32UC Unused in AVR32UC Return Address Register for Debug mode Unused in AVR32UC Unused in AVR32UC Unused in AVR32UC
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Table 4-3.
Reg # 24 25 26 27 28 29 30 31 32 33-63 64 65 66 67 68 69 70 71 72 73 74 75 76 77 78 79 80 81 82 83 84 85 86 87 88 89
System Registers (Continued)
Address 96 100 104 108 112 116 120 124 128 132-252 256 260 264 268 272 276 280 284 288 292 296 300 304 308 312 316 320 324 328 332 336 340 344 348 352 356 Name JAVA_LV1 JAVA_LV2 JAVA_LV3 JAVA_LV4 JAVA_LV5 JAVA_LV6 JAVA_LV7 JTBA JBCR Reserved CONFIG0 CONFIG1 COUNT COMPARE TLBEHI TLBELO PTBR TLBEAR MMUCR TLBARLO TLBARHI PCCNT PCNT0 PCNT1 PCCR BEAR MPUAR0 MPUAR1 MPUAR2 MPUAR3 MPUAR4 MPUAR5 MPUAR6 MPUAR7 MPUPSR0 MPUPSR1 Function Unused in AVR32UC Unused in AVR32UC Unused in AVR32UC Unused in AVR32UC Unused in AVR32UC Unused in AVR32UC Unused in AVR32UC Unused in AVR32UC Unused in AVR32UC Reserved for future use Configuration register 0 Configuration register 1 Cycle Counter register Compare register Unused in AVR32UC Unused in AVR32UC Unused in AVR32UC Unused in AVR32UC Unused in AVR32UC Unused in AVR32UC Unused in AVR32UC Unused in AVR32UC Unused in AVR32UC Unused in AVR32UC Unused in AVR32UC Bus Error Address Register MPU Address Register region 0 MPU Address Register region 1 MPU Address Register region 2 MPU Address Register region 3 MPU Address Register region 4 MPU Address Register region 5 MPU Address Register region 6 MPU Address Register region 7 MPU Privilege Select Register region 0 MPU Privilege Select Register region 1
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Table 4-3.
Reg # 90 91 92 93 94 95 96 97 98 99 100 101 102 103 104 105 106 107 108 109 110 111 112-191 192-255
System Registers (Continued)
Address 360 364 368 372 376 380 384 388 392 396 400 404 408 412 416 420 424 428 432 436 440 444 448-764 768-1020 Name MPUPSR2 MPUPSR3 MPUPSR4 MPUPSR5 MPUPSR6 MPUPSR7 MPUCRA MPUCRB MPUBRA MPUBRB MPUAPRA MPUAPRB MPUCR SS_STATUS SS_ADRF SS_ADRR SS_ADR0 SS_ADR1 SS_SP_SYS SS_SP_APP SS_RAR SS_RSR Reserved IMPL Function MPU Privilege Select Register region 2 MPU Privilege Select Register region 3 MPU Privilege Select Register region 4 MPU Privilege Select Register region 5 MPU Privilege Select Register region 6 MPU Privilege Select Register region 7 Unused in this version of AVR32UC Unused in this version of AVR32UC Unused in this version of AVR32UC Unused in this version of AVR32UC MPU Access Permission Register A MPU Access Permission Register B MPU Control Register Secure State Status Register Secure State Address Flash Register Secure State Address RAM Register Secure State Address 0 Register Secure State Address 1 Register Secure State Stack Pointer System Register Secure State Stack Pointer Application Register Secure State Return Address Register Secure State Return Status Register Reserved for future use IMPLEMENTATION DEFINED
4.5
Exceptions and Interrupts
In the AVR32 architecture, events are used as a common term for exceptions and interrupts. AVR32UC incorporates a powerful event handling scheme. The different event sources, like Illegal Op-code and interrupt requests, have different priority levels, ensuring a well-defined behavior when multiple events are received simultaneously. Additionally, pending events of a higher priority class may preempt handling of ongoing events of a lower priority class. When an event occurs, the execution of the instruction stream is halted, and execution is passed to an event handler at an address specified in Table 4-4 on page 34. Most of the handlers are placed sequentially in the code space starting at the address specified by EVBA, with four bytes between each handler. This gives ample space for a jump instruction to be placed there, jumping to the event routine itself. A few critical handlers have larger spacing between them, allowing the entire event routine to be placed directly at the address specified by the EVBA-relative offset generated by hardware. All interrupt sources have autovectored interrupt service routine (ISR) addresses. This allows the interrupt controller to directly specify the ISR address as an address
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relative to EVBA. The autovector offset has 14 address bits, giving an offset of maximum 16384 bytes. The target address of the event handler is calculated as (EVBA | event_handler_offset), not (EVBA + event_handler_offset), so EVBA and exception code segments must be set up appropriately. The same mechanisms are used to service all different types of events, including interrupt requests, yielding a uniform event handling scheme. An interrupt controller does the priority handling of the interrupts and provides the autovector offset to the CPU. 4.5.1 System Stack Issues Event handling in AVR32UC uses the system stack pointed to by the system stack pointer, SP_SYS, for pushing and popping R8-R12, LR, status register, and return address. Since event code may be timing-critical, SP_SYS should point to memory addresses in the IRAM section, since the timing of accesses to this memory section is both fast and deterministic. The user must also make sure that the system stack is large enough so that any event is able to push the required registers to stack. If the system stack is full, and an event occurs, the system will enter an UNDEFINED state. 4.5.2 Exceptions and Interrupt Requests When an event other than scall or debug request is received by the core, the following actions are performed atomically: 1. The pending event will not be accepted if it is masked. The I3M, I2M, I1M, I0M, EM, and GM bits in the Status Register are used to mask different events. Not all events can be masked. A few critical events (NMI, Unrecoverable Exception, TLB Multiple Hit, and Bus Error) can not be masked. When an event is accepted, hardware automatically sets the mask bits corresponding to all sources with equal or lower priority. This inhibits acceptance of other events of the same or lower priority, except for the critical events listed above. Software may choose to clear some or all of these bits after saving the necessary state if other priority schemes are desired. It is the event source's responsability to ensure that their events are left pending until accepted by the CPU. 2. When a request is accepted, the Status Register and Program Counter of the current context is stored to the system stack. If the event is an INT0, INT1, INT2, or INT3, registers R8-R12 and LR are also automatically stored to stack. Storing the Status Register ensures that the core is returned to the previous execution mode when the current event handling is completed. When exceptions occur, both the EM and GM bits are set, and the application may manually enable nested exceptions if desired by clearing the appropriate bit. Each exception handler has a dedicated handler address, and this address uniquely identifies the exception source. 3. The Mode bits are set to reflect the priority of the accepted event, and the correct register file bank is selected. The address of the event handler, as shown in Table 4-4 on page 34, is loaded into the Program Counter. The execution of the event handler routine then continues from the effective address calculated. The rete instruction signals the end of the event. When encountered, the Return Status Register and Return Address Register are popped from the system stack and restored to the Status Register and Program Counter. If the rete instruction returns from INT0, INT1, INT2, or INT3, registers R8-R12 and LR are also popped from the system stack. The restored Status Register contains information allowing the core to resume operation in the previous execution mode. This concludes the event handling.
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4.5.3 Supervisor Calls The AVR32 instruction set provides a supervisor mode call instruction. The scall instruction is designed so that privileged routines can be called from any context. This facilitates sharing of code between different execution modes. The scall mechanism is designed so that a minimal execution cycle overhead is experienced when performing supervisor routine calls from timecritical event handlers. The scall instruction behaves differently depending on which mode it is called from. The behaviour is detailed in the instruction set reference. In order to allow the scall routine to return to the correct context, a return from supervisor call instruction, rets, is implemented. In the AVR32UC CPU, scall and rets uses the system stack to store the return address and the status register. 4.5.4 Debug Requests The AVR32 architecture defines a dedicated Debug mode. When a debug request is received by the core, Debug mode is entered. Entry into Debug mode can be masked by the DM bit in the status register. Upon entry into Debug mode, hardware sets the SR.D bit and jumps to the Debug Exception handler. By default, Debug mode executes in the exception context, but with dedicated Return Address Register and Return Status Register. These dedicated registers remove the need for storing this data to the system stack, thereby improving debuggability. The Mode bits in the Status Register can freely be manipulated in Debug mode, to observe registers in all contexts, while retaining full privileges. Debug mode is exited by executing the retd instruction. This returns to the previous context. 4.5.5 Entry Points for Events Several different event handler entry points exist. In AVR32UC, the reset address is 0x80000000. This places the reset address in the boot flash memory area. TLB miss exceptions and scall have a dedicated space relative to EVBA where their event handler can be placed. This speeds up execution by removing the need for a jump instruction placed at the program address jumped to by the event hardware. All other exceptions have a dedicated event routine entry point located relative to EVBA. The handler routine address identifies the exception source directly. AVR32UC uses the ITLB and DTLB protection exceptions to signal a MPU protection violation. ITLB and DTLB miss exceptions are used to signal that an access address did not map to any of the entries in the MPU. TLB multiple hit exception indicates that an access address did map to multiple TLB entries, signalling an error. All interrupt requests have entry points located at an offset relative to EVBA. This autovector offset is specified by an interrupt controller. The programmer must make sure that none of the autovector offsets interfere with the placement of other code. The autovector offset has 14 address bits, giving an offset of maximum 16384 bytes. Special considerations should be made when loading EVBA with a pointer. Due to security considerations, the event handlers should be located in non-writeable flash memory, or optionally in a privileged memory protection region if an MPU is present. If several events occur on the same instruction, they are handled in a prioritized way. The priority ordering is presented in Table 4-4 on page 34. If events occur on several instructions at different locations in the pipeline, the events on the oldest instruction are always handled before any events on any younger instruction, even if the younger instruction has events of higher priority
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than the oldest instruction. An instruction B is younger than an instruction A if it was sent down the pipeline later than A. The addresses and priority of simultaneous events are shown in Table 4-4 on page 34. Some of the exceptions are unused in AVR32UC since it has no MMU, coprocessor interface, or floatingpoint unit.
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Table 4-4.
Priority 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28
Priority and Handler Addresses for Events
Handler Address 0x80000000 Provided by OCD system EVBA+0x00 EVBA+0x04 EVBA+0x08 EVBA+0x0C EVBA+0x10 Autovectored Autovectored Autovectored Autovectored EVBA+0x14 EVBA+0x50 EVBA+0x18 EVBA+0x1C EVBA+0x20 EVBA+0x24 EVBA+0x28 EVBA+0x2C EVBA+0x30 EVBA+0x100 EVBA+0x34 EVBA+0x38 EVBA+0x60 EVBA+0x70 EVBA+0x3C EVBA+0x40 EVBA+0x44 Name Reset OCD Stop CPU Unrecoverable exception TLB multiple hit Bus error data fetch Bus error instruction fetch NMI Interrupt 3 request Interrupt 2 request Interrupt 1 request Interrupt 0 request Instruction Address ITLB Miss ITLB Protection Breakpoint Illegal Opcode Unimplemented instruction Privilege violation Floating-point Coprocessor absent Supervisor call Data Address (Read) Data Address (Write) DTLB Miss (Read) DTLB Miss (Write) DTLB Protection (Read) DTLB Protection (Write) DTLB Modified Event source External input OCD system Internal MPU Data bus Data bus External input External input External input External input External input CPU MPU MPU OCD system Instruction Instruction Instruction UNUSED Instruction Instruction CPU CPU MPU MPU MPU MPU UNUSED PC of offending instruction PC(Supervisor Call) +2 PC of offending instruction PC of offending instruction PC of offending instruction PC of offending instruction PC of offending instruction PC of offending instruction Stored Return Address Undefined First non-completed instruction PC of offending instruction PC of offending instruction First non-completed instruction First non-completed instruction First non-completed instruction First non-completed instruction First non-completed instruction First non-completed instruction First non-completed instruction PC of offending instruction PC of offending instruction PC of offending instruction First non-completed instruction PC of offending instruction PC of offending instruction PC of offending instruction
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5. Memories
5.1 Embedded Memories
* Internal High-Speed Flash
- 64Kbytes (AT32UC3L064) - 32Kbytes (AT32UC3L032) - 16Kbytes (AT32UC3L016) - 0 Wait State Access at up to 25 MHz in Worst Case Conditions - 1 Wait State Access at up to 50 MHz in Worst Case Conditions - Pipelined Flash Architecture, allowing burst reads from sequential Flash locations, hiding penalty of 1 wait state access - Pipelined Flash Architecture typically reduces the cycle penalty of 1 wait state operation to only 8% compared to 0 wait state operation - 100 000 Write Cycles, 15-year Data Retention Capability - 4ms Page Programming Time, 8 ms Chip Erase Time - Sector Lock Capabilities, Bootloader Protection, Security Bit - 32 Fuses, Erased During Chip Erase - User Page For Data To Be Preserved During Chip Erase * Internal High-Speed SRAM, Single-cycle access at full speed - 16Kbytes (AT32UC3L064, AT32UC3L032) - 8Kbytes (AT32UC3L016)
5.2
Physical Memory Map
The system bus is implemented as a bus matrix. All system bus addresses are fixed, and they are never remapped in any way, not even in boot. Note that AVR32 UC CPU uses unsegmented translation, as described in the AVR32 Architecture Manual. The 32-bit physical address space is mapped as follows:
Table 5-1.
Device
AT32UC3L Physical Memory Map
Start Address 0x00000000 0x80000000 0xFFFE0000 0xFFFF0000 Size
AT32UC3L064 AT32UC3L032 AT32UC3L016
Embedded SRAM Embedded Flash HSB-PB Bridge B HSB-PB Bridge A
16 Kbytes 64 Kbytes 64 Kbytes 64 Kbytes
16 Kbytes 32 Kbytes 64 kBytes 64 Kbytes
8 Kbytes 16 Kbytes 64 Kbytes 64 Kbytes
Table 5-2.
Flash Memory Parameters
Part Number AT32UC3L064 AT32UC3L032 AT32UC3L016 Flash Size (FLASH_PW) 64 Kbytes 32 Kbytes 16 Kbytes Number of pages (FLASH_P) 256 128 64 Page size (FLASH_W) 64 words 64 words 64 words
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5.3 Peripheral Address Map
Peripheral Address Mapping
Address
0xFFFE0000
Table 5-3.
Peripheral Name FLASHCDW Flash Controller - FLASHCDW
Bus
0xFFFE0400
HMATRIX
0xFFFE0800
HSB Matrix - HMATRIX
SAU
0xFFFF0000
Secure Access Unit - SAU
PDCA
0xFFFF1000
Peripheral DMA Controller - PDCA
INTC
0xFFFF1400
Interrupt controller - INTC
PM
0xFFFF1800
Power Manager - PM
SCIF
0xFFFF1C00
System Control Interface - SCIF
AST
0xFFFF2000
Asynchronous Timer - AST
WDT
0xFFFF2400
Watchdog Timer - WDT
EIC
0xFFFF2800
External Interrupt Controller - EIC
FREQM
0xFFFF2C00
Frequency Meter - FREQM
GPIO
0xFFFF3000
General Purpose Input/Output Controller - GPIO Universal Synchronous/Asynchronous Receiver/Transmitter - USART0 Universal Synchronous/Asynchronous Receiver/Transmitter - USART1 Universal Synchronous/Asynchronous Receiver/Transmitter - USART2 Universal Synchronous/Asynchronous Receiver/Transmitter - USART3 Serial Peripheral Interface - SPI
USART0
0xFFFF3400
USART1
0xFFFF3800
USART2
0xFFFF3C00
USART3
0xFFFF4000
SPI
0xFFFF4400
TWIM0
Two-wire Master Interface - TWIM0
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Table 5-3. Peripheral Address Mapping
0xFFFF4800
TWIM1
0xFFFF4C00
Two-wire Master Interface - TWIM1
TWIS0
0xFFFF5000
Two-wire Slave Interface - TWIS0
TWIS1
0xFFFF5400
Two-wire Slave Interface - TWIS1
PWMA
0xFFFF5800
Basic Pulse Width Modulation Controller - PWMA
TC0
0xFFFF5C00
Timer/Counter - TC0
TC1
0xFFFF6000
Timer/Counter - TC1
ADCIFB
0xFFFF6400
ADC Interface - ADCIFB
ACIFB
0xFFFF6800
Analog Comparator Interface - ACIFB
CAT
0xFFFF6C00
Capacitive Touch Module - CAT
GLOC
0xFFFF7000
Glue Logic Controller - GLOC
AW
aWire - AW
5.4
CPU Local Bus Mapping
Some of the registers in the GPIO module are mapped onto the CPU local bus, in addition to being mapped on the Peripheral Bus. These registers can therefore be reached both by accesses on the Peripheral Bus, and by accesses on the local bus. Mapping these registers on the local bus allows cycle-deterministic toggling of GPIO pins since the CPU and GPIO are the only modules connected to this bus. Also, since the local bus runs at CPU speed, one write or read operation can be performed per clock cycle to the local busmapped GPIO registers.
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The following GPIO registers are mapped on the local bus: Table 5-4.
Port A
Local Bus Mapped GPIO Registers
Mode WRITE SET CLEAR TOGGLE Local Bus Address 0x40000040 0x40000044 0x40000048 0x4000004C 0x40000050 0x40000054 0x40000058 0x4000005C 0x40000060 0x40000240 0x40000244 0x40000248 0x4000024C 0x40000250 0x40000254 0x40000258 0x4000025C 0x40000260 Access Write-only Write-only Write-only Write-only Write-only Write-only Write-only Write-only Read-only Write-only Write-only Write-only Write-only Write-only Write-only Write-only Write-only Read-only
Register Output Driver Enable Register (ODER)
Output Value Register (OVR)
WRITE SET CLEAR TOGGLE
Pin Value Register (PVR) B Output Driver Enable Register (ODER)
WRITE SET CLEAR TOGGLE
Output Value Register (OVR)
WRITE SET CLEAR TOGGLE
Pin Value Register (PVR)
-
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6. Boot Sequence
This chapter summarizes the boot sequence of the AT32UC3L. The behavior after power-up is controlled by the Power Manager. For specific details, refer to the Power Manager chapter.
6.1
Starting of Clocks
After power-up, the device will be held in a reset state by the Power-On Reset circuitry for a short time to allow the power to stabilize throughout the device. After reset, the device will use the System RC Oscillator (RCSYS) as clock source. Please refer to Table 7-20 on page 48 for the frequency for this oscillotor. On system start-up, the DFLL is disabled. All clocks to all modules are running. No clocks have a divided frequency; all parts of the system receive a clock with the same frequency as the System RC Oscillator.
6.2
Fetching of Initial Instructions
After reset has been released, the AVR32 UC CPU starts fetching instructions from the reset address, which is 0x80000000. This address points to the first address in the internal Flash. The code read from the internal Flash is free to configure the system to use for example the DFLL, to divide the frequency of the clock routed to some of the peripherals, and to gate the clocks to unused peripherals.
6.3
RC32K Clock Output at Startup
After power-up, the clock generated by the 32kHz RC oscillator (RC32K) will be output on I/O line PA20, even when the device is still reset by the Power-On Reset Circuitry. This clock can be used by the system to start other devices or to clock a switching regulator to rise the power supply voltage up to an acceptable value. The clock will be available on I/O line PA20 until one of the following conditions are true: * PA20 is configured to use a GPIO function other than F (SCIF-RC32OUT) * PA20 is configured as a General Purpose Input/Output (GPIO) * The bit FRC32 in the Power Manager PPCR register is cleared (see Power Manager chapter) The maximum amplitude of the clock signal will be defined by VDDIN.
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7. Electrical Characteristics
7.1 Disclaimer
All values in this chapter are preliminary and subject to change without further notice.
7.2
Absolute Maximum Ratings*
Absolute Maximum Ratings
*NOTICE: Stresses beyond those listed under "Absolute Maximum Ratings" may cause permanent damage to the device. This is a stress rating only and functional operation of the device at these or other conditions beyond those indicated in the operational sections of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability.
Table 7-1.
Operating temperature..................................... -40C to +85C Storage temperature...................................... -60C to +150C Voltage on all pins (except those noted below) .....................................................................-0.3V to VVDDIO+0.3V Voltage on PA11, PA13, PA 20............... .-0.3V to VVDDIN+0.3V Voltage on 5V tolerant pins with respect to ground .... -0.3V to 5.5V DC current per I/O pin................................................. TBD mA DC current VCC and GND pins ................................... TBD mA Maximum operating voltage (VDDCORE) ...................... 1.98V Maximum operating voltage (VDDIO, VDDIN).................. 3.6V
7.3
Supply Characteristics
The following characteristics are applicable to the operating temperature range: TA = -40C to 85C, unless otherwise specified and are certified for a junction temperature up to TJ = 100C. Table 7-2. Supply Characteristics
Voltage Symbol VVDDIO Parameter DC supply peripheral I/Os DC supply peripheral I/Os, 1.8V single supply mode VVDDIN DC supply peripheral I/Os and internal regulator, 3.3V single supply mode DC supply core Analog supply voltage Analog reference voltage Min 1.62 1.62 Max 3.6 1.98 Unit V V
1.98 1.62 1.62 1.62
3.6 1.98 1.98 VVDDANA
V V V V
VVDDCORE VVDDANA VADVREFP
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Table 7-3. Supply Rise Rates and Order
Rise Rate Symbol VVDDIO VVDDIN VVDDCORE VVDDANA Note: Parameter DC supply peripheral I/Os DC supply peripheral I/Os and internal regulator DC supply core Analog supply voltage Min 0 0.002(1) 0 0 Max 2.5 2.5 2.5 2.5 Unit V/s V/s V/s V/s Rise before or at the same time as VDDIO Rise together with VDDCORE Comment
1. Slower rise time requires external power-on circuit.
7.4
Clock Characteristics
These parameters are given in the following conditions: VVDDCORE = 1.62 to 1.98V Temperature = -40C to 85C Table 7-4.
Symbol fCPU fPBA fPBB
Clock Frequencies
Parameter CPU clock frequency PBA clock frequency PBB clock frequency Conditions Min Max 50 50 50 Units MHz MHz MHz
7.5
Power Consumption
The values in Table 7-5 are measured values of power consumption with operating conditions as follows: *VDDIO = 1.8V *VDDCORE =1.8V *TA = 25C *I/Os are inactive with internal pull-up
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Figure 7-1. Measurement Schematic
VDDIO
Amp0
VDDIN
VDDCORE
VDDANA
Table 7-5.
Mode Active Idle Frozen Standby Stop DeepStop Static Static Shutdown Shutdown Note:
Power Consumption for Different Modes
Conditions Active mode Idle (2) Frozen sleep mode
(2) (3) (1)
Measured on Amp0 Amp0 Amp0 Amp0 Amp0 Amp0 Amp0 Amp0 Amp0 Amp0
Consumption Typ 300 150 90 70 30 20 7 5 1.5 0.1
Unit A/MHz A/MHz A/MHz A/MHz A A A A A A
Standby sleep mode Stop sleep mode
(4)
DeepStop sleep mode(4) Static sleep mode with RTC(4) Static sleep mode(5) Shutdown sleep mode with RTC(6) Shutdown sleep mode (7)
1. CPU performing recursive Fibonacci algorithm running from flash. Main clock source is DFLL. XIN0 stopped. XIN32: External clock. DFLL running. No peripheral clocks masked, peripharal clocks divided by 8. GPIOs on internal pull-up. 2. Main clock source is DFLL. XIN0 stopped. XIN32: External clock. DFLL running. No peripheral clocks masked. GPIOs on internal pull-up. 3. Main clock source is DFLL. XIN0 stopped. XIN32: External clock. DFLL running. GPIOs on internal pull-up. 4. XIN0 stopped. XIN32: External clock. DFLL stopped. GPIOs on internal pull-up. 5. XIN0 stopped. XIN32 stopped. DFLL stopped. GPIOs on internal pull-up. 6. XIN0 stopped. XIN32: External clock. DFLL stopped. GPIOs on internal pull-up. 7. XIN0 stopped. XIN32 stopped. GPIOs on internal pull-up.
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Table 7-6.
Peripheral ACIFB ADCIFB AST AW CAT EIC FLASHCDW FREQM GPIO HMATRIX INTC PDCA PM PWMA SAU SCIF SPI TC TWIM TWIS USART WDT
Power Consumption by Peripheral in Active Mode
Consumption Typ TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD A/MHz TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD Unit
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7.6 I/O Pad Characteristics
Normal I/O Pad Characteristics
Parameter Pull-up resistance Input low-level voltage Input high-level voltage Output low-level voltage Output high-level voltage Output low-level current Output high-level current Input leakage current Input capacitance 1. IBIS simulated values Pull-up resistors disabled 3
(1)
Table 7-7.
Symbol RPULLUP VIL VIH VOL VOH IOL IOH ILEAK CIN Note:
Condition
Min
Typ 105k
Max
Units Ohm
-0.3 TBD
+0.8 VVDDIO+0.3 0.4
V V V V
VVDDIO-0.4 2 2 1
mA mA A pF
Table 7-8.
Symbol RPULLUP VIL VIH VOL VOH IOL IOH ILEAK CIN Note:
High-drive I/O Pad Characteristics
Parameter Pull-up resistance Input low-level voltage Input high-level voltage Output low-level voltage Output high-level voltage Output low-level current Output high-level current Input leakage current Input capacitance Pull-up resistors disabled 5
(1)
Condition
Min
Typ 105k
Max
Units Ohm
-0.3 TBD
+0.8 VVDDIO+0.3 0.4
V V V V
VVDDIO-0.4 4 4 1
mA mA A pF
1. IBIS simulated values
Table 7-9.
Symbol RPULLUP VIL VIH VOL VOH IOL
5V Tolerant I/O Pad Characteristics
Parameter Pull-up Resistance Input Low-level Voltage Input High-level Voltage Output Low-level Voltage Output High-level Voltage Output Low-level Current VVDDIO-0.4 TBD -0.3 TBD Condition Min Typ TBD +0.8 5.5V 0.4 Max Units Ohm V V V V mA
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Table 7-9.
Symbol IOH ILEAK CIN
5V Tolerant I/O Pad Characteristics
Parameter Output High-level Current Input Leakage Current Input Capacitance Pull-up resistors disabled TBD Condition Min Typ Max TBD TBD Units mA A pF
Table 7-10.
Symbol RPULLUP VIL VIH VOL VOH IOL IOH ILEAK CIN
TWI Pad Characteristics
Parameter Pull-up Resistance Input Low-level Voltage Input High-level Voltage Output Low-level Voltage Output High-level Voltage Output Low-level Current Output High-level Current Input Leakage Current Input Capacitance Slew Rate Pull-up resistors disabled TBD TBD VVDDIO-0.4 TBD TBD TBD -0.3 TBD Condition Min Typ TBD +0.8 5.5V 0.4 Max Units Ohm V V V V mA mA A pF V/s
Table 7-11.
Symbol RPULLUP VIL VIH VOL
SMBus Compliant Pad Characteristics
Parameter Pull-up Resistance Input Low-level Voltage Input High-level Voltage Output Low-level Voltage Input Voltage Range -0.3 TBD Condition Min Typ TBD +0.8 5.5V 0.4 Max Units Ohm V V V
VOH IOL IOH ILEAK CIN
Output High-level Voltage Output Low-level Current Output High-level Current Input Leakage Current Input Capacitance Slew Rate Pull-up resistors disabled
VVDDIO-0.4 TBD TBD TBD TBD TBD
V mA mA A pF V/s
Table 7-12.
Symbol RPULLUP VIL VIH
Oscillator I/O Pad Characteristics
Parameter Pull-up Resistance Input Low-level Voltage Input High-level Voltage -0.3 TBD Condition Min Typ 30k +0.8 5.5V Max Units Ohm V V
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Table 7-12.
Symbol VOL VOH IOL IOH ILEAK CIN
Oscillator I/O Pad Characteristics
Parameter Output Low-level Voltage Output High-level Voltage Output Low-level Current Output High-level Current Input Leakage Current Input Capacitance Pull-up resistors disabled TBD VVDDIO-0.4 TBD TBD TBD Condition Min Typ Max 0.4 Units V V mA mA A pF
7.7
7.7.1 7.7.1.1
Oscillator Characteristics
Oscillator 0 Characteristics Digital Clock Characteristics The following table describes the characteristics for the oscillator when a digital clock is applied on XIN.
Table 7-13.
Symbol fCPXIN tCHXIN CIN RIN
Digital Clock Characteristics
Parameter XIN clock frequency XIN clock duty cycle XIN input capacitance Optional pull-down resistor 40 TBD TBD Conditions Min Typ Max 50 60 Units MHz % pF k
7.7.1.2
Crystal Oscillator Characteristics The following table describes the characteristics for the oscillator when a crystal is connected between XIN and XOUT.
Table 7-14.
Symbol 1/(tCPMAIN) CL1, CL2 CL tST IOSC
Crystal Oscillator Characteristics
Parameter Crystal oscillator frequency Internal load capacitance (CL1 = CL2) Equivalent load capacitance Startup time Active mode @3MHz. Gain = G0 Current consumption Active mode @16MHz. Gain = G3 Conditions Min 3 TBD TBD TBD TBD Typ Max 16 Unit MHz pF pF ms A
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7.7.2 32 KHz Crystal Oscillator Characteristics 32 KHz Crystal Oscillator Characteristics
Parameter Crystal oscillator frequency Startup time Equivalent load capacitance Current consumption Active mode RS = TBD k, CL = TBD pF(1) TBD 1.5 Conditions Min Typ 32 768 TBD TBD Max Unit Hz ms pF A
Table 7-16.
Symbol 1/(tCP32KHz) tST CL IOSC Note:
1. RS is the equivalent series resistance, CL is the equivalent load capacitance.
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7.7.3 DFLL Characteristics Digital Frequency Locked Loop Characteristics
Parameter Output frequency Input frequency Current consumption Startup time Lock time fIN = 32KHz, fOUT = 50MHz Active mode Conditions Min 20 0.02 TBD TBD TBD Typ Max 150 16 Unit MHz MHz A/MHz cycles ms
Table 7-17.
Symbol fOUT fIN IDFLL tSTARTUP tLOCK
7.7.4
RC120M Characteristics Internal 120MHz RC Oscillator Characteristics
Parameter Output frequency Current consumption Startup time Active mode Conditions Min Typ 120 TBD TBD Max Unit MHz A cycles
Table 7-18.
Symbol fOUT IRC120M tSTARTUP
7.7.5
RC32K 32kHz RC Oscillator Characteristics
Parameter Output frequency Current consumption Startup time Active mode Conditions Min 20 Typ 32 TBD TBD Max 44 Unit kHz A cycles
Table 7-19.
Symbol fOUT IRC32K tSTARTUP
7.7.6
RCSYS System RC Oscillator Characteristics
Parameter Output frequency Current consumption Startup time Tuning resolution Active mode Conditions Min Typ 115 TBD TBD TBD Max Unit kHz A cycles %
Table 7-20.
Symbol fOUT IRCSYS tSTARTUP
7.8
Flash Characteristics
Table 7-21 gives the device maximum operating frequency depending on the number of flash wait states and the flash read mode. The FSW bit in the FLASHCDW FSR register controls the number of wait states used when accessing the flash memory.
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Table 7-21. Maximum Operating Frequency
Read Mode High speed read mode 0 1 Normal read mode 0 15MHz 25MHz 30MHz Maximum Operating Frequency 50MHz
Flash Wait States 1
7.9
7.9.1 7.9.1.1
Analog Characteristics
Regulator Characteristics Electrical Characteristics Electrical Characteristics
Parameter Maximum DC output current with VVDDIN = 3.3V Maximum DC output current with VVDDIN = 1.8V Normal mode TBD TBD Static current of internal regulator Low Power mode A Condition Min Typ Max TBD TBD Units mA mA A
Table 7-22.
Symbol IOUT
ISCR
7.9.1.2 Table 7-23.
Symbol CIN1 CIN2 COUT1 COUT2
Decoupling Requirements Decoupling Requirements
Parameter Input regulator capacitor 1 Input regulator capacitor 2 Output regulator capacitor 1 Output regulator capacitor 2 Condition Typ TBD 10 100 2.2 Tantalum 0.549
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7.9.2 POR Power-on Reset Characteristics
Parameter POR threshold voltage (rising) VPOT POR threshold voltage (falling) Condition Min Typ 1.5 1.3 Max Units V V
Table 7-24.
Symbol
7.9.3
SM33 SM33 Characteristics
Parameter Voltage threshold Condition onsm = `1', without calibration Min Typ 1.8 Max Units V
Table 7-25.
Symbol VTH
7.9.4
POR33 POR33 Characteristics
Parameter Threshold voltage rising Condition Min Typ 1.5 Max Units V
Table 7-26.
Symbol VTH
7.10
7.10.1
Timing Characteristics
RESET_N Characteristics RESET_N Waveform Parameters
Parameter RESET_N minimum pulse length Conditions Min 10 Max Units ns
Table 7-27.
Symbol tRESET
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8. Mechanical Characteristics
8.1
8.1.1
Thermal Considerations
Thermal Data Table 8-1 summarizes the thermal resistance data depending on the package. Table 8-1.
Symbol JA JC JA JC JA JC
Thermal Resistance Data
Parameter Junction-to-ambient thermal resistance Junction-to-case thermal resistance Junction-to-ambient thermal resistance Junction-to-case thermal resistance Junction-to-ambient thermal resistance Junction-to-case thermal resistance Still Air Still Air Condition Still Air Package TQFP48 TQFP48 QFN48 QFN48 TLLGA48 TLLGA48 Typ TBD TBD TBD TBD TBD TBD C/W C/W Unit C/W
8.1.2
Junction Temperature The average chip-junction temperature, TJ, in C can be obtained from the following: 1. 2. T J = T A + ( P D x JA )
T J = T A + ( P D x ( HEATSINK + JC ) )
where: * JA = package thermal resistance, Junction-to-ambient (C/W), provided in Table 8-1. * JC = package thermal resistance, Junction-to-case thermal resistance (C/W), provided in Table 8-1. * HEAT SINK = cooling device thermal resistance (C/W), provided in the device datasheet. * PD = device power consumption (W) estimated from data provided in the Section 7.5 on page 41. * TA = ambient temperature (C). From the first equation, the user can derive the estimated lifetime of the chip and decide if a cooling device is necessary or not. If a cooling device is to be fitted on the chip, the second equation should be used to compute the resulting average chip-junction temperature TJ in C.
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8.2 Package Drawings
TQFP-48 Package Drawing
Figure 8-1.
Table 8-2.
TBD
Device and Package Maximum Weight
mg
Table 8-3.
Package Characteristics
TBD
Moisture Sensitivity Level
Table 8-4.
Package Reference
MS-026 E3
JEDEC Drawing Reference JESD97 Classification
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Figure 8-2. QFN-48 Package Drawing
Table 8-5.
TBD
Device and Package Maximum Weight
mg
Table 8-6.
Package Characteristics
TBD
Moisture Sensitivity Level
Table 8-7.
Package Reference
M0-220 E3
JEDEC Drawing Reference JESD97 Classification
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Figure 8-3. TLLGA-48 Package Drawing
Table 8-8.
TBD
Device and Package Maximum Weight
mg
Table 8-9.
Package Characteristics
TBD
Moisture Sensitivity Level
Table 8-10.
Package Reference
M0-220 E3
JEDEC Drawing Reference JESD97 Classification
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8.3 Soldering Profile
Table 8-11 gives the recommended soldering profile from J-STD-20. Table 8-11. Soldering Profile
Green Package 3C/s max 60-120 s 60-150 s 30 s 260C 6C/s max 8 minutes max
Profile Feature Average Ramp-up Rate (217C to Peak) Preheat Temperature 175C 25C Temperature Maintained Above 217C Time within 5C of Actual Peak Temperature Peak Temperature Range Ramp-down Rate Time 25C to Peak Temperature
A maximum of three reflow passes is allowed per component.
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9. Ordering Information
Table 9-1.
Device
Ordering Information
Ordering Code AT32UC3L064-AUT AT32UC3L064-AUR Carrier Type Tray Tape & Reel Tray Tape & Reel Tape & Reel Tray Tape & Reel Tray Tape & Reel Tape & Reel Tray Tape & Reel Tray Tape & Reel Tape & Reel Package TQFP 48 TQFP 48 QFN 48 QFN 48 TLLGA 48 TQFP 48 TQFP 48 QFN 48 QFN 48 TLLGA 48 TQFP 48 TQFP 48 QFN 48 QFN 48 TLLGA 48 JESD97 Classification E3 Industrial (-40C to 85C) Package Type Temperature Operating Range
AT32UC3L064
AT32UC3L064-ZAUT AT32UC3L064-ZAUR AT32UC3L064-D3UR AT32UC3L032-AUT AT32UC3L032-AUR
AT32UC3L032
AT32UC3L032-ZAUT AT32UC3L032-ZAUR AT32UC3L032-D3UR AT32UC3L016-AUT AT32UC3L016-AUR
AT32UC3L016
AT32UC3L016-ZAUT AT32UC3L016-ZAUR AT32UC3L016-D3UR
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10. Errata
10.1
10.1.1
Rev. C
SCIF 1. A reset from Supply Monitor 33 will be registered as POR A Supply Monitor 33 reset will not be detected in the Reset Cause register (RCAUSE) as BOD33, it will be detected as a Power-on Reset (POR). Fix/Workaround None.
10.1.2
SPI 1. SPI disable does not work in SLAVE mode SPI disable does not work in SLAVE mode. Fix/Workaround Read the last received data, then perform a Software Reset. 2. SPI Bad Serial Clock Generation on 2nd chip select when SCBR = 1, CPOL=1, and NCPHA=0 When multiple CS are in use, if one of the baudrates equals 1 and one of the others does not equal 1, and CPOL=1 and CPHA=0, an additional pulse will be generated on SCK. Fix/Workaround When multiple CS are in use, if one of the baudrates equals 1, the others must also equal 1 if CPOL=1 and CPHA=0. 3. SPI data transfer hangs with CSAAT=1 in CSR0 and MODFDIS=0 in MR When CSAAT=1 in CSR0 and mode fault detection is enabled (MODFDIS=0 in MR), the SPI module will not start a data transfer. Fix/Workaround Disable mode fault detection by writing a one to MODFDIS in MR. 4. Disabling SPI has no effect on the TDRE flag Disabling SPI has no effect on TDRE whereas the write data command is filtered when SPI is disabled. This means that as soon as the SPI is disabled it becomes impossible to reset the TDRE flag by writing in the TDR. So if the SPI is disabled during a PDCA transfer, the PDCA will continue to write data in the TDR (as TDRE stays high) until its buffer is empty, and all data written after the disable command is lost. Fix/Workaround Disable the PDCA, 2 NOP (minimum), disable SPI. When you want to continue the transfer: Enable SPI, enable PDCA.
10.2
10.2.1
Rev. B
Processor and Architecture 1. RETS behaves incorrectly when MPU is enabled RETS behaves incorrectly when MPU is enabled and MPU is configured so that system stack is not readable in unprivileged mode. Fix/Workaround Make system stack readable in unprivileged mode, or return from supervisor mode using rete instead of rets. This requires: 1. Changing the mode bits from 001 to 110 before issuing the instruction. Updating the mode bits to the desired value must be done using a single mtsr instruction so it is done
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atomically. Even if this step is described in general as not safe in the UC technical reference manual, it is safe in this very specific case. 2. Execute the RETE instruction. 10.2.2 FLASHCDW 1. Chip erase When performing chip erase, the device may report that it is protected (IR=0x11) and that chiperase failed, even if the chip erase was succesful. Fix/workaround Perform a reset before any further read and programming. 2. Fuse programming Programming of fuses does not work. Fix/workaround Do not program fuses. All fuses will be erased during chiperase command. 3. Wait 500 ns before reading from the flash after switching read mode After switching between normal read mode and high-speed read mode, the application must wait at least 500 ns before attempting any access to the flash. Fix/workaround Two workarounds exist: 1. Make sure that the appropriate instructions are executed from RAM, and that a waitingloop is executed from RAM waiting 500ns or more before executing from flash. 2. Execute from flash with a clock with period longer than 500 ns. This guarantees that no new read access is attempted before the flash has had time to settle in the new read mode. 4. VERSION register reads 0x100 The VERSION register reads 0x100 instead of 0x102. Fix/Workaround None. 10.2.3 HMATRIX 1. In the HMATRIX PRAS and PRBS registers MxPR fields are only two bits In the HMATRIX PRAS and PRBS registers MxPR fields are only two bits wide, instead of four bits. The unused bits are undefined when reading the registers. Fix/Workaround Mask undefined bits when reading PRAS and PRBS. 10.2.4 PDCA 1. PCONTROL.CHxRES is nonfunctional PCONTROL.CHxRES is nonfunctional. Counters are reset at power-on, and cannot be reset by software. Fix/Workaround SW needs to keep history of performance counters. 2. Transfer error will stall a transmit peripheral handshake interface. If a transfer error is encountered on a channel transmitting to a peripheral, the peripheral handshake of the active channel will stall and the PDCA will not do any more transfers on the affected peripheral handshake interface. Fix/workaround Disable and then enable the peripheral after the transfer error. 3. VERSION register reads 0x120 The VERSION register reads 0x120 instead of 0x122. 58
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Fix/Workaround None. 10.2.5 GPIO 1. GPIO interrupt flag can not be cleared when interrupts are disabled The GPIO interrupt flag can not be cleared unless the interrupt is enabled for the pin. Fix/workaround Enable interrupt for the corresponding pin, then clear the interrupt flag. 2. VERSION register reads 0x210 The VERSION register reads 0x210 instead of 0x211. Fix/Workaround None. 10.2.6 PM 1. OCP and high frequency clock sources OCP does not work if the main clock source is a high frequency clock. If the frequency of the source exceeds the maximum frequency of the CRIPOSC the OCP will generate an interrupt and switch clock source to the slow clock upon enabling the OCP, even if the CPU clock is divided to a legal frequency. Fix/Workaround Do not use clock sources with frequencies higher that the maximum CPU frequency while using the OCP. 2. CONFIG register reads 0x4F The CONFIG register reads 0x4F instead of 0x43. Fix/Workaround None. 3. PB writes via debugger in sleep modes are blocked during sleepwalking During sleepwalking, PB writes performed by a debugger will be discarded by all PB modules except the module that is requesting the clock. Fix/workaround None. 4. VERSION register reads 0x400 The VERSION register reads 0x400 instead of 0x411. Fix/Workaround None. 5. WCAUSE register should not be used The WCAUSE register should not be used. Fix/Workaround None. 6. Clock failure detector does not work In some cases the clock failure detector will not detect if the CPU clock stops. In this case the CPU will halt operation. Fix/Workaround None. 10.2.7 SCIF 1. A reset from Supply Monitor 33 will be registered as POR
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A Supply Monitor 33 reset will not be detected in the Reset Cause register (RCAUSE) as BOD33, it will be detected as a Power-on Reset (POR). Fix/Workaround None. 2. The DFLL should be slowed down before disabled The frequency of the DFLL should be set to minimum before disabled. Fix/Workaround Before disabling the DFLL the value of the COARSE register should be set to zero. 3. Writing to SCIF ICR masks new interrupts received in the same clock cycle Writing to SCIF ICR masks any new SCIF interrupt received in the same clock cycle, regardless of write value. Fix/Workaround: For every interrupt except BODDET, SM33DET, and VREGOK the CLKSR register can be read to detect new interrupts. BODDET, SM33DET and VREGOK interrupts will not be generated if they occur when writing SCIF ICR. 4. FINE value for DFLL is not correct when dithering is disabled In open loop mode, the FINE value used by the DFLL DAC is offseted by two compared to the value written to the DFLL0CONF.FINE field. I. e. the value to the DFLL DAC is DFLL0CONF.FINE-0x002. If DFLL0CONF.FINE is written to 0x000, 0x001 or 0x002 the value to the DFLL DAC will be 0x1FE, 0x1FF or 0x000 respectively. Fix/workaround Write the desired value added by two to the DFLL0CONF.FINE field. 5. BODVERSION register reads 0x100 The BODVERSION register reads 0x100 instead of 0x101. Fix/Workaround None. 7. BRIFA is non-functional BRIFA is non-functional. Fix/Workaround None. 8. VREGCR DEEPMODEDISABLE bit is not readable VREGCR DEEPMODEDISABLE bit is not readable. Fix/workaround None. 9. DFLL step size should be 7 or lower below 30 MHz If max step size is above 7, the DFLL might not lock at the correct frequency if the target frequency is below 30 MHz. Fix/Workaround If the target frequency is below 30 MHz, use max step size (DFLL0MAXSTEP.MAXSTEP) of 7 or lower. 10. Generic clock sources are kept running in sleep modes If a clock is used as a source for a generic clock when going to a sleep mode where clock sources are stopped, the source of the generic clock will be kept running. Please refer to the Power Manager chapter for details about sleep modes. Fix/Workaround 60
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Disable generic clocks before going to sleep modes where clock sources are stopped to save power. 11. DFLL clock is unstable with a fast reference clock The DFLL clock can be unstable when a fast clock is used as reference clock in closed loop mode. Fix/Workaround Use the 32 KHz crystal oscillator clock or a clock with similar frequency as DFLLIF reference clock. 12. DFLLIF indicates coarse lock too early The DFLLIF might indicate coarse lock too early, the DFLL will lose coarse lock and regain it later. Fix/Workaround Use max step size (DFLL0MAXSTEP.MAXSTEP) of 4 or higher. 13. DFLLIF dithering does not work The DFLLIF dithering does not work. Fix/Workaround None. 14. SCIF VERSION register reads 0x100 The VERSION register reads 0x100 instead of 0x102. Fix/Workaround None. 15. DFLLVERSION register reads 0x200 The DFLLVERSION register reads 0x200 instead of 0x201. Fix/Workaround None. 16. RCCRVERSION register reads 0x100 The RCCRVERSION register reads 0x100 instead of 0x101. Fix/Workaround None. 17. OSC32VERSION register reads 0x100 The OSC32VERSION register reads 0x100 instead of 0x101. Fix/Workaround None. 18. VREGVERSION register reads 0x100 The VREGVERSION register reads 0x100 instead of 0x101. Fix/Workaround None. 19. RC120MVERSION register reads 0x100 The RC120MVERSION register reads 0x100 instead of 0x101. Fix/Workaround None. 10.2.8 WDT 1. Clearing of the WDT in window mode
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In window mode, if the WDT is cleared 2 CLK_WDT cycles after entering the window. The counter will be cleared, but will not exit the window. If this occurs, the SR.WINDOW bit will not be cleared after clearing the WDT. Fix/Workaround Check SR.WINDOW immediately after clearing the WDT. If set then clear the WDT once more. 2. VERSION register reads 0x400 The VERSION register reads 0x400 instead of 0x402. Fix/Workaround None. 10.2.9 SPI 1. SPI disable does not work in SLAVE mode SPI disable does not work in SLAVE mode. Fix/Workaround Read the last received data, then perform a Software Reset. 2. SPI Bad Serial Clock Generation on 2nd chip select when SCBR = 1, CPOL=1, and NCPHA=0 When multiple CS are in use, if one of the baudrates equals 1 and one of the others does not equal 1, and CPOL=1 and CPHA=0, an additional pulse will be generated on SCK. Fix/Workaround When multiple CS are in use, if one of the baudrates equals 1, the others must also equal 1 if CPOL=1 and CPHA=0. 3. SPI data transfer hangs with CSAAT=1 in CSR0 and MODFDIS=0 in MR When CSAAT=1 in CSR0 and mode fault detection is enabled (MODFDIS=0 in MR), the SPI module will not start a data transfer. Fix/Workaround Disable mode fault detection by writing a one to MODFDIS in MR. 4. Disabling SPI has no effect on the TDRE flag Disabling SPI has no effect on TDRE whereas the write data command is filtered when SPI is disabled. This means that as soon as the SPI is disabled it becomes impossible to reset the TDRE flag by writing in the TDR. So if the SPI is disabled during a PDCA transfer, the PDCA will continue to write data in the TDR (as TDRE stays high) until its buffer is empty, and all data written after the disable command is lost. Fix/Workaround Disable the PDCA, 2 NOP (minimum), disable SPI. When you want to continue the transfer: Enable SPI, enable PDCA. 10.2.10 TWI 1. TWIM Version Register is zero TWIM Version Register (VR) reads zero instead of 0x101. Fix/Workaround none. 2. TWIS Version Register is zero TWIS Version Register (VR) reads zero instead of 0x112. Fix/Workaround None. 3. TWIS CR.STREN does not work in deep sleep modes 62
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AT32UC3L
When the device is in Stop, DeepStop or Static sleep modes, address reception will not wake device if both CR.SOAM and CR.STREN are set. Fix/workaround Do not set both CR.STREN and CR.SOAM if the device needs to wake from deep sleep. 4. TWI pads are not SMBUS compatible The TWI pads draws current when the pins are supplied with 3.3V and the part is left unpowered. Fix/workaround None. 5. PA21, PB04, and PB05 are not 5V tolerant Pins PA21, PB04, and PB05 are only 3.3 V tolerant. Fix/workaround None. 6. PB04 SMBALERT function should not be used The SMBALERT function from TWIMS0 should not be selected on pin PB04. Fix/workaround None. 7. TWI0.TWCK on PB05 is non-functional TWI0.TWCK on PB05 is non-functional. Fix/workaround Use TWI0.TWCK on other pins. 8. TWIM STOP bit in IMR always read as zero The STOP bit in IMR always reads as zero. Fix/workaround None. 10.2.11 PWMA 1. PARAMETER register reads 0x2424 The PARAMETER register reads 0x2424 instead of 0x24. Fix/Workaround None. 2. Open Drain mode does not work The open drain mode does not work. Fix/workaround None. 3. VERSION register reads 0x100 The VERSION register reads 0x100 instead of 0x101. Fix/Workaround None. 4. Writing to the duty cycle registers when the timebase counter overflows can give undefined result The duty cycle registers will be corrupted if written when the timebase counter overflows. If the duty cycle registers are written exactly when the timebase counter overflows at TOP, the duty cycle registers may become corrupted. Fix/workaround
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Write to the duty cycle registers only directly after the Timebase Overflow bit in the status register is set. 10.2.12 SAU 1. Idle bit reads as zero The idle bit reads as zero. Fix/workaround None. 2. Open mode is not functional The open mode is not functional. Fix/workaround None. 3. VERSION register reads 0x100 The VERSION register reads 0x100 instead of 0x110. Fix/Workaround None. 10.2.13 ADCIFB 1. Pendetect in sleep modes without CLK_ADCIFB will not wake the system The pendetect will not wake the system from a sleep mode if the clock for the ADCIFB (CLK_ADCIFB) is turned off. Fix/Workaround Use a sleep mode where CLK_ADCIFB is not turned off to wake the part using pendetect. 2. 8-bit mode is not working Do not use the 8-bit mode of the ADCIFB. Fix/Workaround Use the 10-bit mode and shift right by 2 bits. 3. ADC channels six to eight is non-functional ADC channels six to eight is non-functional. Fix/Workaround None. 4. VERSION register reads 0x100 The VERSION register reads 0x100 instead of 0x101. Fix/Workaround None. 10.2.14 ACIFB 1. Negative offset The static offset of the analog comparator is appriximately -50mV. Fix/Workaround None. 2. Generic clock sources in sleep modes The ACIFB should not use RC32K, or CLK_1K as generic clock source if the chip uses sleep modes. Fix/Workaround None.
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3. VERSION register reads 0x200 The VERSION register reads 0x200 instead of 0x212. Fix/Workaround None. 4. CONFW.WEVSRC and CONFW.WEVEN are not correctly described in the user interface CONFW.WEVSRC is only two bits instead of three bits wide. Only values 0, 1, and 2 can be written to this register. CONFW.WEVEN is in bit position 10 instead of 11. Fix/workaround Only write values 0, 1, and 2 to CONFW.WEVSRC. When reading CONFW.WEVSRC, disregard the third bit. Read/write bit 10 to access CONFW.WEVEN. 10.2.15 USART 1. The RTS output does not function correctly in hardware handshaking mode The RTS signal is not generated properly when the USART receives data in hardware handshaking mode. When the Peripheral DMA receive buffer becomes full, the RTS output should go high, but it will stay low. Fix/workaround Do not use the hardware handshaking mode of the USART. If it is necessary to drive the RTS output high when the Peripheral DMA receive buffer becomes full, use the normal mode of the USART. Configure the Peripheral DMA Controller to signal an interrupt when the receive buffer is full. In the interrupt handler code, write a one to the RTSDIS bit in the USART Control Register (CR). This will drive the RTS output high. After the next DMA transfer is started and a receive buffer is available, write a one to the RTSEN bit in the USART CR so that RTS will be driven low. 10.2.16 TC 1. When the main clock is RCSYS, TIMER_CLOCK5 is equal to PBA clock When the main clock is generated from RCSYS, TIMER_CLOCK5 is equal to PBA Clock and not PBA Clock / 128. Fix/workaround None. 10.2.17 CAT 1. Switch off discharge current when reaching 0V The discharge current will switch off when reaching MGCFG1.MAX, not when reaching 0V. Fix/workaround None. 2. CAT external capacitors are not clamped to ground when CAT is idle The CAT module does not clamp the external capacitors to ground when it is idle. The capacitors are left floating, so they could accumulate small amounts of charge. Fix/workaround None. 3. CAT DISHIFT field is stuck at zero The DISHIFT field in the MGCFG1, TGACFG1, TGBCFG1, and ATCFG1 registers is stuck at zero and cannot be written to a different value. Capacitor discharge time will be determined only by the DILEN field. Fix/workaround None. 4. CAT ACCTRL bit is stuck at zero 65
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The ACCTRL bit in the MGCFG2 register is stuck at zero and cannot be written to one. The analog comparators will be constantly enabled. Fix/workaround None. 5. CAT CONSEN field is stuck at zero The CONSEN field in the MGCFG2 register is stuck at zero and cannot be written to a different value. The CAT consensus filter does not function properly, so termination of QMatrix data acquisition is controlled only by the MAX field in MGCFG1. Fix/workaround None. 6. VERSION register reads 0x100 The VERSION register reads 0x100 instead of 0x200. Fix/Workaround None. 10.2.18 aWire 1. aWire PB mapping and PB clock mask number The aWire PB has a different PB address and PB clock mask number. Fix/workaround Use Awire PB address 0xFFFF6C00 and PB clock (PBAMASK) 24. 2. SAB multiaccess reads are not working Reading more than one word, halfword, or byte in one command is not workingcorrectly. Fix/workaround Split the access into several single word, halfword, or byte accesses. 3. If a reset happens during the last SAB write, the aWire will stall If a reset happens during the last word, halfword or byte write the aWire will wait forever for an acknowledge from the SAB. Fix/workaround Reset the aWire by keeping the RESET_N line low for 100 ms. 4. aWire enable does not work in static mode aWire enable does not work in static mode. Fix/workaround None. 5. VERSION register reads 0x200 The VERSION register reads 0x200 instead of 0x210. Fix/Workaround None. 10.2.19 GLOC 1. GLOC is non-functional Gloc is non-functional. Fix/workaround None. 10.2.20 I/O pins 1. PB10 is not 3.3V tolerant PB10 should be grounded on the PCB and left unused. Fix/workaround 66
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None. 2. Analog multiplexing consumes extra power Current consumption on VDDIO increases when the voltage on analog inputs is close to VDDIO/2. Fix/workaround None. 3. PA02, PB01, PB04, PB05, RESET_N have half of the pullup strength Pins PA02, PB01, PB04, PB05, RESET_N have half of the specified pullup strength. Fix/workaround None. 4. OCD MCKO and MDO[3] are swapped in the AUX1 mapping When using the OCD AUX1 mapping of trace signals MDO[3] is located on pin PB05 and MCKO is located on PB01. Fix/workaround Swap pins PB01 and PB05 if using OCD AUX1. 10.2.21 Chip 1. Power consumption in static mode is too high Power consumption in static mode is too high when PA21 is high Fix/workaround Ensure PA21 is low. 2. Shutdown mode is not functional Do not enter shutdown mode. Fix/workaround None. 3. Static mode cannot be entered if the WDT is using OSC32 If the WDT is using OSC32 as clock source and the user tries to enter the static sleep mode, the DeepStop sleep mode will be entered instead. Fix/workaround None. 4. VDDIN current consumption increase above 1.8V When VDDIN increases above 1.8 V, current on VDDIN increases with up to 40 uA. Fix/workaround None.
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11. Datasheet Revision History
Please note that the referring page numbers in this section are referred to this document. The referring revision in this section are referring to the document revision.
11.1
Rev. A - 06/09
1.
Initial revision.
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Table of Contents
Features ..................................................................................................... 1 1 2 Description ............................................................................................... 3 Overview ................................................................................................... 5
2.1 2.2 Block Diagram ...................................................................................................5 Configuration Summary .....................................................................................6
3
Package and Pinout ................................................................................. 7
3.1 3.2 3.3 3.4 3.5 Package .............................................................................................................7 Peripheral Multiplexing on I/O lines ...................................................................7 Signal Descriptions ..........................................................................................12 I/O Line Considerations ...................................................................................15 Power Considerations .....................................................................................15
4
Processor and Architecture .................................................................. 21
4.1 4.2 4.3 4.4 4.5 Features ..........................................................................................................21 AVR32 Architecture .........................................................................................21 The AVR32UC CPU ........................................................................................22 Programming Model ........................................................................................26 Exceptions and Interrupts ................................................................................30
5
Memories ................................................................................................ 35
5.1 5.2 5.3 5.4 Embedded Memories ......................................................................................35 Physical Memory Map .....................................................................................35 Peripheral Address Map ..................................................................................36 CPU Local Bus Mapping .................................................................................37
6
Boot Sequence ....................................................................................... 39
6.1 6.2 6.3 Starting of Clocks ............................................................................................39 Fetching of Initial Instructions ..........................................................................39 RC32K Clock Output at Startup .......................................................................39
7
Electrical Characteristics ...................................................................... 40
7.1 7.2 7.3 7.4 7.5 Disclaimer ........................................................................................................40 Absolute Maximum Ratings* ...........................................................................40 Supply Characteristics .....................................................................................40 Clock Characteristics .......................................................................................41 Power Consumption ........................................................................................41
i
32099AS-AVR32-06/09
7.6 7.7 7.8 7.9 7.10
I/O Pad Characteristics ....................................................................................44 Oscillator Characteristics .................................................................................46 Flash Characteristics .......................................................................................48 Analog Characteristics .....................................................................................49 Timing Characteristics .....................................................................................50
8
Mechanical Characteristics ................................................................... 51
8.1 8.2 8.3 Thermal Considerations ..................................................................................51 Package Drawings ...........................................................................................52 Soldering Profile ..............................................................................................55
9
Ordering Information ............................................................................. 56
10 Errata ....................................................................................................... 57
10.1 10.2 Rev. C ..............................................................................................................57 Rev. B ..............................................................................................................57
11 Datasheet Revision History ................................................................... 68
11.1 Rev. A - 06/09 .................................................................................................68
Table of Contents...................................................................................... 1
Headquarters
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32099AS-AVR32-06/09


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